Shem Ogadhoh

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated interconnect li...
- Patent number 12,080,643
- Issue date Sep 3, 2024
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,991,873
- Issue date May 21, 2024
- Intel Corporation
- Travis W. Lajoie
Information Patent Grant
Capacitor connections in dielectric layers
- Patent number 11,832,438
- Issue date Nov 28, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate separation layers at the back-end-of-line
- Patent number 11,652,047
- Issue date May 16, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,610,894
- Issue date Mar 21, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill pattern to enhance ebeam process margin
- Patent number 11,581,162
- Issue date Feb 14, 2023
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of contact patterning of thin film transistors for embedded...
- Patent number 11,563,107
- Issue date Jan 24, 2023
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor structures with gas spacer
- Patent number 11,404,536
- Issue date Aug 2, 2022
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 11,121,073
- Issue date Sep 14, 2021
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill pattern to enhance e-beam process margin
- Patent number 11,107,658
- Issue date Aug 31, 2021
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography mask having sub-resolution phased assist features
- Patent number 9,046,761
- Issue date Jun 2, 2015
- Intel Corporation
- Shem O. Ogadhoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Techniques for phase tuning for process optimization
- Patent number 8,959,465
- Issue date Feb 17, 2015
- Intel Corporation
- Paul A. Nyhus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mask design and OPC for device manufacture
- Patent number 8,778,605
- Issue date Jul 15, 2014
- Intel Corporation
- Shem Ogadhoh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mask design and OPC for device manufacture
- Patent number 8,404,403
- Issue date Mar 26, 2013
- Intel Corporation
- Shem Ogadhoh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lithography mask having sub-resolution phased assist features
- Patent number 8,399,157
- Issue date Mar 19, 2013
- Intel Corporation
- Shem O. Ogadhoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process window-based correction for photolithography masks
- Patent number 7,470,492
- Issue date Dec 30, 2008
- Intel Corporation
- Robert M. Bigwood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS
- Publication number 20250159953
- Publication date May 15, 2025
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AND DOUBLE PATTERNING STRATEGY WITH PRINTED ERASABLE DUMMIFICATION
- Publication number 20250006495
- Publication date Jan 2, 2025
- Intel Corporation
- Allen Gardiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM PATTERNING FOR FORMING ANGLED TRANSISTORS
- Publication number 20240105798
- Publication date Mar 28, 2024
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS
- Publication number 20240105596
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL WAFER DEVICE WITH MULTIPLE DIRECTIONAL INDICATORS
- Publication number 20240071955
- Publication date Feb 29, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20240049450
- Publication date Feb 8, 2024
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STATIC RANDOM-ACCESS MEMORY DEVICES WITH ANGLED TRANSISTORS
- Publication number 20230422463
- Publication date Dec 28, 2023
- Intel Corporation
- Abhishek A. Sharma
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS AND ANGLED ROUTI...
- Publication number 20230420363
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ELECTRICAL CONTACT FOR PMOS EPITAXIAL VOLTAGE SUPPLY
- Publication number 20230317612
- Publication date Oct 5, 2023
- Intel Corporation
- Clifford ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL LAYERS OF A TRANSISTOR ELECTRICALLY COUPLED WITH A BACKSI...
- Publication number 20230317148
- Publication date Oct 5, 2023
- Intel Corporation
- Clifford ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...
- Publication number 20230290722
- Publication date Sep 14, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES
- Publication number 20230207445
- Publication date Jun 29, 2023
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20230200043
- Publication date Jun 22, 2023
- Intel Corporation
- Travis W. LAJOIE
Information Patent Application
MULTILEVEL WORDLINE ASSEMBLY FOR EMBEDDED DRAM
- Publication number 20220415897
- Publication date Dec 29, 2022
- Intel Corporation
- Juan G. Alzate-Vinasco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20220320275
- Publication date Oct 6, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
- Publication number 20210366821
- Publication date Nov 25, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN
- Publication number 20210358713
- Publication date Nov 18, 2021
- Intel Corporation
- Shakul TANDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS
- Publication number 20210125992
- Publication date Apr 29, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...
- Publication number 20210098373
- Publication date Apr 1, 2021
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20200411520
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERMEDIATE SEPARATION LAYERS AT THE BACK-END-OF-LINE
- Publication number 20200411426
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAPS AND CAPACITORS IN DIELECTRIC LAYERS
- Publication number 20200411635
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20200411525
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTACT PATTERNING OF THIN FILM TRANSISTORS FOR EMBEDDED...
- Publication number 20200303520
- Publication date Sep 24, 2020
- Intel Corporation
- Chieh-Jen KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20190305081
- Publication date Oct 3, 2019
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
- Publication number 20190304897
- Publication date Oct 3, 2019
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN
- Publication number 20190164723
- Publication date May 30, 2019
- Intel Corporation
- Shakul TANDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PHASE TUNING FOR PROCESS OPTIMIZATION
- Publication number 20140053117
- Publication date Feb 20, 2014
- Paul A. Nyhus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LITHOGRAPHY MASK HAVING SUB-RESOLUTION PHASED ASSIST FEATURES
- Publication number 20130216941
- Publication date Aug 22, 2013
- Shem O. Ogadhoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MASK DESIGN AND OPC FOR DEVICE MANUFACTURE
- Publication number 20130149638
- Publication date Jun 13, 2013
- Shem OGADHOH
- G06 - COMPUTING CALCULATING COUNTING

Shem Ogadhoh

Person

Patents Grantslast 30 patents

Through plate interconnect for a vertical MIM capacitor

Integrated circuit structures having differentiated interconnect li...

Capacitor separations in dielectric layers

Capacitor connections in dielectric layers

Intermediate separation layers at the back-end-of-line

Capacitor separations in dielectric layers

Fill pattern to enhance ebeam process margin

Method of contact patterning of thin film transistors for embedded...

Thin-film transistor structures with gas spacer

Through plate interconnect for a vertical MIM capacitor

Fill pattern to enhance e-beam process margin

Lithography mask having sub-resolution phased assist features

Techniques for phase tuning for process optimization

Mask design and OPC for device manufacture

Mask design and OPC for device manufacture

Lithography mask having sub-resolution phased assist features

Process window-based correction for photolithography masks

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS

AND DOUBLE PATTERNING STRATEGY WITH PRINTED ERASABLE DUMMIFICATION

TRIM PATTERNING FOR FORMING ANGLED TRANSISTORS

INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS

FULL WAFER DEVICE WITH MULTIPLE DIRECTIONAL INDICATORS

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

STATIC RANDOM-ACCESS MEMORY DEVICES WITH ANGLED TRANSISTORS

INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS AND ANGLED ROUTI...

BACKSIDE ELECTRICAL CONTACT FOR PMOS EPITAXIAL VOLTAGE SUPPLY

EPITAXIAL LAYERS OF A TRANSISTOR ELECTRICALLY COUPLED WITH A BACKSI...

PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...

HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

MULTILEVEL WORDLINE ASSEMBLY FOR EMBEDDED DRAM

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR

FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN

INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

INTERMEDIATE SEPARATION LAYERS AT THE BACK-END-OF-LINE

AIR GAPS AND CAPACITORS IN DIELECTRIC LAYERS

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

METHOD OF CONTACT PATTERNING OF THIN FILM TRANSISTORS FOR EMBEDDED...

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR

FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN

TECHNIQUES FOR PHASE TUNING FOR PROCESS OPTIMIZATION

LITHOGRAPHY MASK HAVING SUB-RESOLUTION PHASED ASSIST FEATURES

MASK DESIGN AND OPC FOR DEVICE MANUFACTURE