Sheng-Hsiang Chiu

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having antenna and manufacturing method thereof
- Patent number 12,057,415
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 12,011,859
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, package structure and fabricating method thereof
- Patent number 11,855,006
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 11,731,327
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having antenna on chip package and manufacturi...
- Patent number 11,705,409
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus, manufacturing method of molded semiconductor dev...
- Patent number 11,446,851
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 11,309,226
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced INFO POP and method of forming thereof
- Patent number 10,797,025
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having antenna and manufacturing method thereof
- Patent number 10,741,508
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and method
- Patent number 10,325,883
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,283,377
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,283,470
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid design for heat dissipation enhancement of die package
- Patent number 10,163,754
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensing device and fabricating method thereof
- Patent number 9,966,394
- Issue date May 8, 2018
- Industrial Technology Research Institute
- Feng-Chia Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 9,859,229
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Peng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and method
- Patent number 9,818,729
- Issue date Nov 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of dicing a semiconductor structure
- Patent number 8,048,778
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Yu Ku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE
- Publication number 20240404954
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...
- Publication number 20240293962
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071954
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE
- Publication number 20240071953
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...
- Publication number 20230347561
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF
- Publication number 20230307391
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067664
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230062468
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20230035212
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...
- Publication number 20220362975
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20220238407
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20210193544
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced INFO POP and Method of Forming Thereof
- Publication number 20210020611
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEV...
- Publication number 20200338796
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF
- Publication number 20200335459
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200020634
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190333877
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139787
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337149
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure and Method
- Publication number 20180068985
- Publication date Mar 8, 2018
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced INFO POP and Method of Forming Thereof
- Publication number 20170338202
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170317038
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Peng TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSING DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20170186786
- Publication date Jun 29, 2017
- Industrial Technology Research Institute
- Feng-Chia Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Design for Heat Dissipation Enhancement of Die Package
- Publication number 20150187679
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for bump-on-trace Chip Packaging
- Publication number 20130277828
- Publication date Oct 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS

Sheng-Hsiang Chiu

Person

Patents Grantslast 30 patents

Semiconductor device having antenna and manufacturing method thereof

Molding apparatus and manufacturing method of molded semiconductor...

Advanced info POP and method of forming thereof

Memory device, package structure and fabricating method thereof

Molding apparatus and manufacturing method of molded semiconductor...

Semiconductor device having antenna on chip package and manufacturi...

Molding apparatus, manufacturing method of molded semiconductor dev...

Three-dimensional integrated circuit structures and methods of form...

Advanced INFO POP and method of forming thereof

Semiconductor device having antenna and manufacturing method thereof

Package-on-package structure and method

Integrated fan-out package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Lid design for heat dissipation enhancement of die package

Light sensing device and fabricating method thereof

Package structure and method for forming the same

Package-on-package structure and method

Methods of dicing a semiconductor structure

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE

MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...

PACKAGE STRUCTURE

METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

Advanced INFO POP and Method of Forming Thereof

MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEV...

SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF

PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Package-on-Package Structure and Method

Advanced INFO POP and Method of Forming Thereof

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

LIGHT SENSING DEVICE AND FABRICATING METHOD THEREOF

Lid Design for Heat Dissipation Enhancement of Die Package

Methods and Apparatus for bump-on-trace Chip Packaging