Sheng HU

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated circuit device
- Patent number 11,804,458
- Issue date Oct 31, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,791,367
- Issue date Oct 17, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for determining expansion compensation in phot...
- Patent number 11,264,242
- Issue date Mar 1, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure with capacitive chip interconnection, method for ma...
- Patent number 11,114,414
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for manufacturing the same
- Patent number 11,114,401
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of image sensing device
- Patent number 11,107,856
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with vertically separated openings and manufac...
- Patent number 11,043,448
- Issue date Jun 22, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having opening and via hole and method for man...
- Patent number 11,024,534
- Issue date Jun 1, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Beibei Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,943,853
- Issue date Mar 9, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving bonding of dangling bonds of silicon atoms
- Patent number 10,840,085
- Issue date Nov 17, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xilong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer chip and fabrication method thereof
- Patent number 10,756,061
- Issue date Aug 25, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jing Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DICING METHOD, BONDING METHOD AND DIE
- Publication number 20240332079
- Publication date Oct 3, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240234476
- Publication date Jul 11, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FA...
- Publication number 20240153911
- Publication date May 9, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240136387
- Publication date Apr 25, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20240105532
- Publication date Mar 28, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhigang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20240055459
- Publication date Feb 15, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...
- Publication number 20240038631
- Publication date Feb 1, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20240006454
- Publication date Jan 4, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yan XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HANDLING TEST PAD AND METHOD OF FABRICATING SEMICONDUCTOR...
- Publication number 20230395440
- Publication date Dec 7, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378232
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20230378233
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MATCHING DESIGN METHOD, WAFER BONDING STRUCTURE AND CHIP BOND...
- Publication number 20230335504
- Publication date Oct 19, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Beibei SHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230253439
- Publication date Aug 10, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Liliang GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170223
- Publication date Jun 1, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO, LTD
- Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230163102
- Publication date May 25, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230053721
- Publication date Feb 23, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Xing HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE
- Publication number 20230020810
- Publication date Jan 19, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415644
- Publication date Dec 29, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20220399282
- Publication date Dec 15, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220310682
- Publication date Sep 29, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220293646
- Publication date Sep 15, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210167116
- Publication date Jun 3, 2021
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Apparatus For Determining Expansion Compensation In Phot...
- Publication number 20210035805
- Publication date Feb 4, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Structure, Method For Manufacturing The Same, And Chip Structure
- Publication number 20210028151
- Publication date Jan 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method For Manufacturing The Same
- Publication number 20200411368
- Publication date Dec 31, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Beibei SHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure And Method For Manufacturing The Same
- Publication number 20200365539
- Publication date Nov 19, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075483
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075460
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF IMAGE SENSING DEVICE
- Publication number 20200013824
- Publication date Jan 9, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- PENG SUN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of fabricating the same

Method of fabricating integrated circuit device

Semiconductor device and method of fabricating the same

Method and apparatus for determining expansion compensation in phot...

Wafer structure with capacitive chip interconnection, method for ma...

Bonding structure and method for manufacturing the same

Manufacturing method of image sensing device

Semiconductor device with vertically separated openings and manufac...

Semiconductor device having opening and via hole and method for man...

Semiconductor device and manufacturing method thereof

Method for improving bonding of dangling bonds of silicon atoms

Multi-layer chip and fabrication method thereof

Patents Applicationslast 30 patents

DICING METHOD, BONDING METHOD AND DIE

IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

METHOD FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FA...

IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...

BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...

METHOD OF HANDLING TEST PAD AND METHOD OF FABRICATING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

WAFER MATCHING DESIGN METHOD, WAFER BONDING STRUCTURE AND CHIP BOND...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method And Apparatus For Determining Expansion Compensation In Phot...

Wafer Structure, Method For Manufacturing The Same, And Chip Structure

Semiconductor Device And Method For Manufacturing The Same

Bonding Structure And Method For Manufacturing The Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF IMAGE SENSING DEVICE