Sheng-Hui Chien

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Chu-Nan, TW

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Patents Applicationslast 30 patents

Information Patent Application
Method for fabricating package structure of stacked chips
- Publication number 20100035380
- Publication date Feb 11, 2010
- Kun Yuan Technology Co., Ltd.
- Chun-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of integrated circuits having space elements
- Publication number 20090294943
- Publication date Dec 3, 2009
- Kun Yuan Technology Co., Ltd.
- Sheng-Hui Chien
- H01 - BASIC ELECTRIC ELEMENTS