Sheng-Wei FU

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 11,081,560
- Issue date Aug 3, 2021
- Vanguard International Semiconductor Corporation
- Tsung-Yeh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 10,770,396
- Issue date Sep 8, 2020
- Vanguard International Semiconductor Corporation
- Fang-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 10,615,263
- Issue date Apr 7, 2020
- Vanguard International Semiconductor Corporation
- Tsung-Yeh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 10,600,906
- Issue date Mar 24, 2020
- Vanguard International Semiconductor Corporation
- Chung-Yen Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 10,510,878
- Issue date Dec 17, 2019
- Vanguard International Semiconductor Corporation
- Chung-Yen Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20240021475
- Publication date Jan 18, 2024
- Vanguard International Semiconductor Corporation
- Po-Hsiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20230420529
- Publication date Dec 28, 2023
- Vanguard International Semiconductor Corporation
- Po-Hsiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230081775
- Publication date Mar 16, 2023
- XINTEC INC.
- Hsin-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200211964
- Publication date Jul 2, 2020
- Vanguard International Semiconductor Corporation
- Fang-Ming LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20200194564
- Publication date Jun 18, 2020
- Vanguard International Semiconductor Corporation
- Tsung-Yeh CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20200075758
- Publication date Mar 5, 2020
- Vanguard International Semiconductor Corporation
- Chung-Yen CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20190386132
- Publication date Dec 19, 2019
- Vanguard International Semiconductor Corporation
- Chung-Yen CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20190378902
- Publication date Dec 12, 2019
- Vanguard International Semiconductor Corporation
- Tsung-Yeh CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Sheng-Wei FU

Person

Patents Grantslast 30 patents

Semiconductor devices and methods for forming the same

Semiconductor structure and method for fabricating the same

Semiconductor devices and methods for forming the same

Semiconductor devices and methods for forming the same

Semiconductor devices and methods for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHODS FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME