Sherif A. Goma

Person

Hawthorne, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Processing for overcoming extreme topography
- Patent number 9,263,292
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Inc.
- Guy M. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming metallized elastomeric electrical contacts
- Patent number 8,832,936
- Issue date Sep 16, 2014
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing for overcoming extreme topography
- Patent number 8,603,846
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,551,816
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,237,271
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser release process for very thin Si-carrier build
- Patent number 8,187,923
- Issue date May 29, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer structures and methods of manufacturing the same
- Patent number 8,159,248
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metalized elastomeric probe structure
- Patent number 8,054,095
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing for overcoming extreme topography
- Patent number 7,915,064
- Issue date Mar 29, 2011
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Technology for fabrication of packaging interface substrate wafers...
- Patent number 7,880,305
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Yu-Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical contact buttons
- Patent number 7,823,278
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Gareth G Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metalized elastomeric electrical contacts
- Patent number 7,771,208
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structures and methods of manufacturing the same
- Patent number 7,688,095
- Issue date Mar 30, 2010
- International Business Machines Corporation
- Steven A. Cordes
- G01 - MEASURING TESTING
Information Patent Grant
Interposer with electrical contact button and method
- Patent number 7,648,369
- Issue date Jan 19, 2010
- International Business Machines Corporation
- Gareth G Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for coupling probes of probe device to corresponding elec...
- Patent number 7,456,640
- Issue date Nov 25, 2008
- International Business Machines Corporation
- Ronald Richard Breton
- G01 - MEASURING TESTING
Information Patent Grant
Metalized elastomeric electrical contacts
- Patent number 7,452,212
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- G01 - MEASURING TESTING
Information Patent Grant
Silicon chip carrier with conductive through-vias and method for fa...
- Patent number 7,276,787
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with electrical contact button and method
- Patent number 7,137,827
- Issue date Nov 21, 2006
- International Business Machines Corporation
- Gareth G Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density raised stud microjoining system and methods of fabrica...
- Patent number 6,732,908
- Issue date May 11, 2004
- International Business Machines Corporation
- Bruce Kenneth Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RISK PREDICTION FOR SERVICE CONTRACTS VASED ON CO-OCCURENCE CLUSTERS
- Publication number 20150294249
- Publication date Oct 15, 2015
- SINEM GUVEN KAYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Financial Risk Analytics for Service Contracts
- Publication number 20140149175
- Publication date May 29, 2014
- International Business Machines Corporation
- Geraldine L. Abbott
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Financial Risk Analytics for Service Contracts
- Publication number 20140149174
- Publication date May 29, 2014
- International Business Machines Corporation
- Geraldine L. Abbott
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY
- Publication number 20140141618
- Publication date May 22, 2014
- International Business Machines Corporation
- Guy M. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Direct Edge Connection for Multi-Chip Integrated Circuits
- Publication number 20120187577
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20120091585
- Publication date Apr 19, 2012
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY
- Publication number 20110130005
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20100038126
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Steven A. Cordes
- G01 - MEASURING TESTING
Information Patent Application
Technology for fabrication of packaging interface substrate wafers...
- Publication number 20090302454
- Publication date Dec 10, 2009
- Yu- Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metallized Elastomeric Electrical Contacts
- Publication number 20090300914
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY
- Publication number 20090298292
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Metalized Elastomeric Electrical Contacts
- Publication number 20090053908
- Publication date Feb 26, 2009
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer with Electrical Contact Button and Method
- Publication number 20090044405
- Publication date Feb 19, 2009
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20090032920
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS
- Publication number 20080315409
- Publication date Dec 25, 2008
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metalized Elastomeric Probe Structure
- Publication number 20080094085
- Publication date Apr 24, 2008
- Gareth Geoffrey Hougham
- G01 - MEASURING TESTING
Information Patent Application
Laser release process for very thin Si-carrier build
- Publication number 20080036084
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20080030209
- Publication date Feb 7, 2008
- International Business Machines Corporation
- Steven A. Cordes
- G01 - MEASURING TESTING
Information Patent Application
Metalized Elastomeric Electrical Contacts
- Publication number 20070298626
- Publication date Dec 27, 2007
- Gareth Geoffrey Hougham
- G01 - MEASURING TESTING
Information Patent Application
Structure for coupling probes of probe device to corresponding elec...
- Publication number 20070200572
- Publication date Aug 30, 2007
- Ronald Richard Breton
- G01 - MEASURING TESTING
Information Patent Application
INTERPOSER WITH ELECTRICAL CONTACT BUTTON AND METHOD
- Publication number 20070087588
- Publication date Apr 19, 2007
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20060027934
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer structures and improved processes for use in probe techn...
- Publication number 20060024861
- Publication date Feb 2, 2006
- International Business Machines Corporation
- Steven A. Cordes
- G01 - MEASURING TESTING
Information Patent Application
Processing for overcoming extreme topography
- Publication number 20060009038
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Interposer with electrical contact button and method
- Publication number 20060009050
- Publication date Jan 12, 2006
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20050121768
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer with electrical contact button and method
- Publication number 20050106902
- Publication date May 19, 2005
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Technology for fabrication of packaging interface substrate wafers...
- Publication number 20040089948
- Publication date May 13, 2004
- Yu-Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High density raised stud microjoining system and methods of fabrica...
- Publication number 20030136814
- Publication date Jul 24, 2003
- International Business Machines Corporation
- Bruce Kenneth Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sherif A. Goma

Person

Patents Grantslast 30 patents

Processing for overcoming extreme topography

Method of forming metallized elastomeric electrical contacts

Processing for overcoming extreme topography

Direct edge connection for multi-chip integrated circuits

Direct edge connection for multi-chip integrated circuits

Laser release process for very thin Si-carrier build

Interposer structures and methods of manufacturing the same

Metalized elastomeric probe structure

Processing for overcoming extreme topography

Technology for fabrication of packaging interface substrate wafers...

Method for fabricating electrical contact buttons

Metalized elastomeric electrical contacts

Interposer structures and methods of manufacturing the same

Interposer with electrical contact button and method

Structure for coupling probes of probe device to corresponding elec...

Metalized elastomeric electrical contacts

Silicon chip carrier with conductive through-vias and method for fa...

Interposer with electrical contact button and method

High density raised stud microjoining system and methods of fabrica...

Patents Applicationslast 30 patents

RISK PREDICTION FOR SERVICE CONTRACTS VASED ON CO-OCCURENCE CLUSTERS

Financial Risk Analytics for Service Contracts

Financial Risk Analytics for Service Contracts

PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

Direct Edge Connection for Multi-Chip Integrated Circuits

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME

Technology for fabrication of packaging interface substrate wafers...

Metallized Elastomeric Electrical Contacts

PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

Metalized Elastomeric Electrical Contacts

Interposer with Electrical Contact Button and Method

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS

Metalized Elastomeric Probe Structure

Laser release process for very thin Si-carrier build

INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME

Metalized Elastomeric Electrical Contacts

Structure for coupling probes of probe device to corresponding elec...

INTERPOSER WITH ELECTRICAL CONTACT BUTTON AND METHOD

Silicon chip carrier with conductive through-vias and method for fa...

Interposer structures and improved processes for use in probe techn...

Processing for overcoming extreme topography

Interposer with electrical contact button and method

Silicon chip carrier with conductive through-vias and method for fa...

Interposer with electrical contact button and method

Technology for fabrication of packaging interface substrate wafers...

High density raised stud microjoining system and methods of fabrica...