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Shidong Li
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Poughkeepsie, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic package structure with offset stacked chips and top and...
Patent number
11,887,908
Issue date
Jan 30, 2024
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Asymmetric die bonding
Patent number
11,784,160
Issue date
Oct 10, 2023
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth module
Patent number
11,756,930
Issue date
Sep 12, 2023
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Near tier decoupling capacitors
Patent number
11,694,992
Issue date
Jul 4, 2023
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
Patent number
11,569,181
Issue date
Jan 31, 2023
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit substrate with mixed pitch wiring
Patent number
11,527,462
Issue date
Dec 13, 2022
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lid/heat spreader having targeted flexibility
Patent number
11,430,710
Issue date
Aug 30, 2022
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polygon integrated circuit (IC) packaging
Patent number
11,410,894
Issue date
Aug 9, 2022
International Business Machines Corporation
Charles L. Arvin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Optimized weight heat spreader for an electronic package
Patent number
11,410,905
Issue date
Aug 9, 2022
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminated stiffener to control the warpage of electronic chip carriers
Patent number
11,302,651
Issue date
Apr 12, 2022
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid TIMs for electronic package cooling
Patent number
11,264,306
Issue date
Mar 1, 2022
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth module
Patent number
11,201,136
Issue date
Dec 14, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tamper-respondent assembly with structural material within sealed i...
Patent number
11,191,155
Issue date
Nov 30, 2021
International Business Machines Corporation
Hongqing Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Active control of electronic package warpage
Patent number
11,121,096
Issue date
Sep 14, 2021
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple chip carrier for bridge assembly
Patent number
10,916,507
Issue date
Feb 9, 2021
International Business Machines Corporation
Charles L Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
Patent number
10,892,233
Issue date
Jan 12, 2021
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous thermal interface material for corner and or edge deg...
Patent number
10,804,181
Issue date
Oct 13, 2020
International Business Machines Corporation
Marcus E. Interrante
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced-warpage laminate structure
Patent number
10,685,919
Issue date
Jun 16, 2020
International Business Machines Corporation
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming an electronic package
Patent number
10,636,746
Issue date
Apr 28, 2020
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Step pyramid shaped structure to reduce dicing defects
Patent number
10,636,750
Issue date
Apr 28, 2020
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduction of laminate failure in integrated circuit (IC) device car...
Patent number
10,607,928
Issue date
Mar 31, 2020
International Business Machines Corporation
Anson J. Call
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lid attach optimization to limit electronic package warpage
Patent number
10,593,564
Issue date
Mar 17, 2020
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip carrier with in-plane thermal conductance l...
Patent number
10,566,313
Issue date
Feb 18, 2020
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with lattice construction and embedded conductive metal...
Patent number
10,460,956
Issue date
Oct 29, 2019
International Business Machines Corporation
Jean Audet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test cell for laminate and method
Patent number
10,381,276
Issue date
Aug 13, 2019
International Business Machines Corporation
Sushumna Iruvanti
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Lid attach optimization to limit electronic package warpage
Patent number
10,332,813
Issue date
Jun 25, 2019
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test cell for laminate and method
Patent number
10,249,548
Issue date
Apr 2, 2019
International Business Machines Corporation
Sushumna Iruvanti
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Lid attach optimization to limit electronic package warpage
Patent number
10,083,886
Issue date
Sep 25, 2018
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging for high speed chip to chip communication
Patent number
10,083,919
Issue date
Sep 25, 2018
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Limiting electronic package warpage
Patent number
10,056,268
Issue date
Aug 21, 2018
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Electronic Package Structure With Offset Stacked Chips And Top And...
Publication number
20230197552
Publication date
Jun 22, 2023
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE CIRCUIT STRUCTURE FOR CIRCUIT LINE BENDING
Publication number
20220418110
Publication date
Dec 29, 2022
International Business Machines Corporation
Hongqing Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
NEAR TIER DECOUPLING CAPACITORS
Publication number
20220271005
Publication date
Aug 25, 2022
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FATIGUE FAILURE RESISTANT ELETRONIC PACKAGE
Publication number
20220157685
Publication date
May 19, 2022
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASYMMETRIC DIE BONDING
Publication number
20220093556
Publication date
Mar 24, 2022
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH BANDWIDTH MODULE
Publication number
20220059499
Publication date
Feb 24, 2022
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH BANDWIDTH MODULE
Publication number
20210288025
Publication date
Sep 16, 2021
International Business Machines Corporation
Charles Leon Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY
Publication number
20210233825
Publication date
Jul 29, 2021
International Business Machines Corporation
SHIDONG LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION
Publication number
20210233824
Publication date
Jul 29, 2021
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT SUBSTRATE WITH MIXED PITCH WIRING
Publication number
20210183753
Publication date
Jun 17, 2021
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
Publication number
20210118819
Publication date
Apr 22, 2021
International Business Machines Corporation
SUSHUMNA IRUVANTI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heterogeneous Lid Seal Band for Structural Stability in Multiple In...
Publication number
20210111093
Publication date
Apr 15, 2021
International Business Machines Corporation
Tuhin Sinha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING
Publication number
20210098334
Publication date
Apr 1, 2021
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
Publication number
20210074599
Publication date
Mar 11, 2021
International Business Machines Corporation
Charles L. Arvin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ACTIVE CONTROL OF ELECTRONIC PACKAGE WARPAGE
Publication number
20200303322
Publication date
Sep 24, 2020
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTIMIZED WEIGHT HEAT SPREADER FOR AN ELECTRONIC PACKAGE
Publication number
20200303279
Publication date
Sep 24, 2020
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heterogeneous Thermal Interface Material for Corner and or Edge Deg...
Publication number
20200294880
Publication date
Sep 17, 2020
Marcus E. Interrante
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY
Publication number
20200176383
Publication date
Jun 4, 2020
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
Publication number
20200135662
Publication date
Apr 30, 2020
International Business Machines Corporation
SUSHUMNA IRUVANTI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Chip Carrier with In-Plane Thermal Conductance L...
Publication number
20200135701
Publication date
Apr 30, 2020
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STEP PYRAMID SHAPED STRUCTURE TO REDUCE DICING DEFECTS
Publication number
20200118942
Publication date
Apr 16, 2020
International Business Machines Corporation
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Chip Carrier with In-Plane Thermal Conductance L...
Publication number
20200066680
Publication date
Feb 27, 2020
Shidong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COGNITIVE TOOL FOR TEACHING GENERLIZATION OF OBJECTS TO A PERSON
Publication number
20200051447
Publication date
Feb 13, 2020
International Business Machines Corporation
Krishna R. Tunga
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
Publication number
20200013732
Publication date
Jan 9, 2020
International Business Machines Corporation
Kamal K. SIKKA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
Publication number
20190267332
Publication date
Aug 29, 2019
International Business Machines Corporation
Kamal K. SIKKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSESSING AND MINIMIZING INTEGRATED CIRCUIT (IC) CHIP WARPAGE DURIN...
Publication number
20190120708
Publication date
Apr 25, 2019
International Business Machines Corporation
Chandrasekharan Kothandaraman
G01 - MEASURING TESTING
Information
Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
Publication number
20180233381
Publication date
Aug 16, 2018
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST CELL FOR LAMINATE AND METHOD
Publication number
20180076101
Publication date
Mar 15, 2018
International Business Machines Corporation
Sushumna Iruvanti
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
Publication number
20180068916
Publication date
Mar 8, 2018
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
Publication number
20180068917
Publication date
Mar 8, 2018
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS