Shigeharu Tsunoda

Person

Fujisawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin powder material, laser powder molding method and device
- Patent number 11,634,577
- Issue date Apr 25, 2023
- Hitachi, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Powder layered modeling apparatus
- Patent number 11,279,083
- Issue date Mar 22, 2022
- Hitachi, Ltd.
- Akihiro Yamaguchi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Layer laminating molded object, powder layer laminating molding met...
- Patent number 10,751,937
- Issue date Aug 25, 2020
- Hitachi, Ltd.
- Akihiro Yamaguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic control device and method for manufacturing electronic c...
- Patent number 10,568,226
- Issue date Feb 18, 2020
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laser welded structure, electronic controller and manufacture metho...
- Patent number 10,507,617
- Issue date Dec 17, 2019
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow sensor and manufacturing method thereof
- Patent number 9,964,424
- Issue date May 8, 2018
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow sensor and method for producing resin structure
- Patent number 9,945,707
- Issue date Apr 17, 2018
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flow sensor
- Patent number 9,880,034
- Issue date Jan 30, 2018
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flow sensor
- Patent number 9,880,040
- Issue date Jan 30, 2018
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flow sensor with a housing that accommodates an auxiliary channel h...
- Patent number 9,778,086
- Issue date Oct 3, 2017
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flow sensor with a protruding portion for height control and a cove...
- Patent number 9,778,085
- Issue date Oct 3, 2017
- Hitachi Automotive Systems, Ltd.
- Satoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pipe module
- Patent number 8,524,345
- Issue date Sep 3, 2013
- Hitachi Plant Technologies, Ltd.
- Yoshio Oozeki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device including first substrate having plurality of...
- Patent number 8,110,907
- Issue date Feb 7, 2012
- Elpida Memory, Inc.
- Masahiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, rubber product, and methods for manufacturing th...
- Patent number 7,172,130
- Issue date Feb 6, 2007
- Hitachi, Ltd.
- Shigeharu Tsunoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wireless communication medium and method of manufacturing the same
- Patent number 7,141,451
- Issue date Nov 28, 2006
- Hitachi, Ltd.
- Shigeharu Tsunoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing RFID
- Patent number 7,122,087
- Issue date Oct 17, 2006
- Hitachi, Ltd.
- Naoya Kanda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having projected electrodes and structure for...
- Patent number 7,084,498
- Issue date Aug 1, 2006
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,057,283
- Issue date Jun 6, 2006
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same and semi...
- Patent number 6,930,388
- Issue date Aug 16, 2005
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the devices
- Patent number 6,861,294
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including insulating layer having a protrus...
- Patent number 6,822,317
- Issue date Nov 23, 2004
- Renesas Technology Corporation
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 6,770,547
- Issue date Aug 3, 2004
- Renesas Technology Corporation
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device a ball grid array pa...
- Patent number 6,686,226
- Issue date Feb 3, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,624,504
- Issue date Sep 23, 2003
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a ball grid a...
- Patent number 6,114,192
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ball grid array package structure usi...
- Patent number 5,914,531
- Issue date Jun 22, 1999
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 5,811,877
- Issue date Sep 22, 1998
- Hitachi, Ltd.
- Ichiro Miyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of uniformly encapsulating a semiconductor device in resin
- Patent number 5,371,044
- Issue date Dec 6, 1994
- Hitachi, Ltd.
- Isamu Yoshida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of encapsulating semiconductor chips
- Patent number 5,110,515
- Issue date May 5, 1992
- Hitachi, Ltd.
- Shozo Nakamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin encapsulating apparatus for semiconductor devices
- Patent number 4,983,110
- Issue date Jan 8, 1991
- Hitachi, Ltd.
- Isamu Yoshida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
POWDER LAYERED MODELING APPARATUS
- Publication number 20190275736
- Publication date Sep 12, 2019
- Hitachi, Ltd
- Akihiro YAMAGUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN POWDER, RESIN MOLDED ARTICLE, AND LASER POWDER MOLDING DEVICE
- Publication number 20190111617
- Publication date Apr 18, 2019
- Hitachi, Ltd
- Satoshi ARAI
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC CONTROL DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC C...
- Publication number 20180352670
- Publication date Dec 6, 2018
- Hitachi Automotive Systems, Ltd.
- Satoshi ARAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Layer Laminating Molded Object, Powder Layer Laminating Molding Met...
- Publication number 20180222113
- Publication date Aug 9, 2018
- Hitachi, Ltd
- Akihiro YAMAGUCHI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LASER WELDED STRUCTURE, ELECTRONIC CONTROLLER AND MANUFACTURE METHO...
- Publication number 20170326812
- Publication date Nov 16, 2017
- Hitachi Automotive Systems, Ltd.
- Satoshi ARAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN POWDER MATERIAL, LASER POWDER MOLDING METHOD AND DEVICE
- Publication number 20170190905
- Publication date Jul 6, 2017
- Satoshi ARAI
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Flow Rate Sensor
- Publication number 20160252379
- Publication date Sep 1, 2016
- Hitachi Automotive Systems, Ltd.
- Satoshi ARAI
- G01 - MEASURING TESTING
Information Patent Application
Flow Sensor and Method for Producing Resin Structure
- Publication number 20160061642
- Publication date Mar 3, 2016
- Hitachi Automotive Systems Ltd
- Satoshi ARAI
- G01 - MEASURING TESTING
Information Patent Application
Flow Sensor
- Publication number 20160025542
- Publication date Jan 28, 2016
- Hitachi Automotive Systems, Ltd.
- Satoshi ARAI
- G01 - MEASURING TESTING
Information Patent Application
Flow Sensor and Manufacturing Method Thereof
- Publication number 20160011029
- Publication date Jan 14, 2016
- Hitachi Automotive Systems, Ltd.
- Satoshi ARAI
- G01 - MEASURING TESTING
Information Patent Application
Flow Sensor
- Publication number 20150377670
- Publication date Dec 31, 2015
- Hitachi Automotive Systems, Ltd.
- Satoshi ARAI
- G01 - MEASURING TESTING
Information Patent Application
Flow Sensors and Manufacturing Method for Same
- Publication number 20150192446
- Publication date Jul 9, 2015
- HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Satoshi Arai
- B32 - LAYERED PRODUCTS
Information Patent Application
PIPE MODULE
- Publication number 20120040122
- Publication date Feb 16, 2012
- Yoshio Oozeki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR ATTACHING A TEMPORARY MATERIAL TO A PIPING MODULE AND ME...
- Publication number 20120037303
- Publication date Feb 16, 2012
- Satoshi ARAI
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Semiconductor device
- Publication number 20090206492
- Publication date Aug 20, 2009
- Elpida Memory, Inc.
- Masahiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVIC...
- Publication number 20080185729
- Publication date Aug 7, 2008
- Elpida Memory, Inc.
- Masahiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing RFID
- Publication number 20050130425
- Publication date Jun 16, 2005
- Naoya Kanda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device, rubber product, and methods for manufacturing th...
- Publication number 20050101060
- Publication date May 12, 2005
- Shigeharu Tsunoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wireless communication medium and method of manufacturing the same
- Publication number 20050085010
- Publication date Apr 21, 2005
- Shigeharu Tsunoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20040195687
- Publication date Oct 7, 2004
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods of making the devices
- Publication number 20040063272
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and structure for mounting the same
- Publication number 20030071331
- Publication date Apr 17, 2003
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same and semi...
- Publication number 20020063332
- Publication date May 30, 2002
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Shigeharu Tsunoda

Person

Patents Grantslast 30 patents

Resin powder material, laser powder molding method and device

Powder layered modeling apparatus

Layer laminating molded object, powder layer laminating molding met...

Electronic control device and method for manufacturing electronic c...

Laser welded structure, electronic controller and manufacture metho...

Flow sensor and manufacturing method thereof

Flow sensor and method for producing resin structure

Flow sensor

Flow sensor

Flow sensor with a housing that accommodates an auxiliary channel h...

Flow sensor with a protruding portion for height control and a cove...

Pipe module

Semiconductor device including first substrate having plurality of...

Electronic device, rubber product, and methods for manufacturing th...

Wireless communication medium and method of manufacturing the same

Method of manufacturing RFID

Semiconductor device having projected electrodes and structure for...

Semiconductor device and method for producing the same

Semiconductor device and method for manufacturing the same and semi...

Semiconductor devices and methods of making the devices

Semiconductor apparatus including insulating layer having a protrus...

Method for producing a semiconductor device

Method of manufacturing a semiconductor device a ball grid array pa...

Semiconductor device and method for manufacturing the same

Method of manufacturing a semiconductor device having a ball grid a...

Semiconductor device having a ball grid array package structure usi...

Semiconductor device structure

Method of uniformly encapsulating a semiconductor device in resin

Method of encapsulating semiconductor chips

Resin encapsulating apparatus for semiconductor devices

Patents Applicationslast 30 patents

POWDER LAYERED MODELING APPARATUS

RESIN POWDER, RESIN MOLDED ARTICLE, AND LASER POWDER MOLDING DEVICE

ELECTRONIC CONTROL DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC C...

Layer Laminating Molded Object, Powder Layer Laminating Molding Met...

LASER WELDED STRUCTURE, ELECTRONIC CONTROLLER AND MANUFACTURE METHO...

RESIN POWDER MATERIAL, LASER POWDER MOLDING METHOD AND DEVICE

Flow Rate Sensor

Flow Sensor and Method for Producing Resin Structure

Flow Sensor

Flow Sensor and Manufacturing Method Thereof

Flow Sensor

Flow Sensors and Manufacturing Method for Same

PIPE MODULE

METHOD FOR ATTACHING A TEMPORARY MATERIAL TO A PIPING MODULE AND ME...

Semiconductor device

SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVIC...

Method of manufacturing RFID

Electronic device, rubber product, and methods for manufacturing th...

Wireless communication medium and method of manufacturing the same

Semiconductor device and method for producing the same

Semiconductor devices and methods of making the devices

Semiconductor device and structure for mounting the same

Semiconductor device and method for manufacturing the same and semi...