Shigeki Ichimura

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Oyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Chip supporting substrate for semiconductor package, semiconductor...
- Patent number 6,331,729
- Issue date Dec 18, 2001
- Hitachi Chemical Company, Ltd.
- Masami Yusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin molding material for sealing of electronic component
- Patent number 5,319,005
- Issue date Jun 7, 1994
- Hitachi Chemical Co., Ltd.
- Shinsuke Hagiwara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...