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Shigenori Harada

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  • Ota-Ku, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING METHOD OF WORKPIECE
    • Publication number 20240266221
    • Publication date Aug 8, 2024
    • Disco Corporation
    • Jinyan ZHAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING A WAFER
    • Publication number 20230298881
    • Publication date Sep 21, 2023
    • Disco Corporation
    • Takashi OKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20220367231
    • Publication date Nov 17, 2022
    • Disco Corporation
    • Jinyan ZHAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EDGE TRIMMING METHOD
    • Publication number 20220184768
    • Publication date Jun 16, 2022
    • Disco Corporation
    • Takashi OKAMURA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    CUTTING METHOD
    • Publication number 20220055242
    • Publication date Feb 24, 2022
    • Disco Corporation
    • Takashi OKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20210391217
    • Publication date Dec 16, 2021
    • Disco Corporation
    • Takashi OKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20210346990
    • Publication date Nov 11, 2021
    • Disco Corporation
    • Jinyan ZHAO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210143063
    • Publication date May 13, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210143064
    • Publication date May 13, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210118736
    • Publication date Apr 22, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210118737
    • Publication date Apr 22, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210111074
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210111073
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210074588
    • Publication date Mar 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210074589
    • Publication date Mar 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210043514
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210043513
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210013100
    • Publication date Jan 14, 2021
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210013101
    • Publication date Jan 14, 2021
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TAPE ATTACHING METHOD
    • Publication number 20200399090
    • Publication date Dec 24, 2020
    • Disco Corporation
    • Jinyan ZHAO
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200388536
    • Publication date Dec 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200388537
    • Publication date Dec 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200357695
    • Publication date Nov 12, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200357696
    • Publication date Nov 12, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED WAFER PROCESSING METHOD
    • Publication number 20200343095
    • Publication date Oct 29, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200328118
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200328117
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20200307010
    • Publication date Oct 1, 2020
    • Disco Corporation
    • Takafumi OMORI
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200286785
    • Publication date Sep 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200286784
    • Publication date Sep 10, 2020
    • Disco Corporation
    • Shigenori HARADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR