Shigeo Kuroda

Person

Ome, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer scale or full wafer memory system, packaging method thereof,...
- Patent number 5,309,011
- Issue date May 3, 1994
- Hitachi, Ltd.
- Masanori Tazunoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor integrated circuit device
- Patent number 5,223,454
- Issue date Jun 29, 1993
- Hitachi, Ltd.
- Takayuki Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale of full wafer memory system, packaging method thereof,...
- Patent number 5,191,224
- Issue date Mar 2, 1993
- Hitachi, Ltd.
- Masanori Tazunoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing semiconductor integrated circuit device ha...
- Patent number 5,141,888
- Issue date Aug 25, 1992
- Hitachi, Ltd.
- Mikinori Kawaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having leads for mounting to a surface of a pr...
- Patent number 5,067,007
- Issue date Nov 19, 1991
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor integrated circuit device
- Patent number 5,049,972
- Issue date Sep 17, 1991
- Hitachi, Ltd.
- Takayuki Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing semiconductor integrated circuit device an...
- Patent number 5,011,788
- Issue date Apr 30, 1991
- Hitachi, Ltd.
- Mikinori Kawaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting the semiconductor device
- Patent number 4,965,653
- Issue date Oct 23, 1990
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC with dual groove isolation
- Patent number 4,819,054
- Issue date Apr 4, 1989
- Hitachi, Ltd.
- Mikinori Kawaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component part having lead terminals
- Patent number 4,739,125
- Issue date Apr 19, 1988
- Hitachi, Ltd.
- Yutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor integrated circuit devices
- Patent number 4,469,535
- Issue date Sep 4, 1984
- Hitachi, Ltd.
- Shigeo Kuroda
- H01 - BASIC ELECTRIC ELEMENTS

Shigeo Kuroda

Person

Patents Grantslast 30 patents

Wafer scale or full wafer memory system, packaging method thereof,...

Method of manufacturing semiconductor integrated circuit device

Wafer scale of full wafer memory system, packaging method thereof,...

Process of manufacturing semiconductor integrated circuit device ha...

Semiconductor device having leads for mounting to a surface of a pr...

Method of manufacturing semiconductor integrated circuit device

Process of manufacturing semiconductor integrated circuit device an...

Semiconductor device and method of mounting the semiconductor device

Semiconductor IC with dual groove isolation

Electric component part having lead terminals

Method of fabricating semiconductor integrated circuit devices