Shigeru Sugino

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing through hole of substrate
- Patent number 10,863,629
- Issue date Dec 8, 2020
- Fujitsu Limited
- Kiyoyuki Hatanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wiring board, electronic apparatus, method for attaching sheet meta...
- Patent number 10,624,216
- Issue date Apr 14, 2020
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 10,605,851
- Issue date Mar 31, 2020
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection method of laminated board, inspection module, and pallet
- Patent number 10,393,797
- Issue date Aug 27, 2019
- Fujitsu Limited
- Mitsunori Abe
- G01 - MEASURING TESTING
Information Patent Grant
Substrate and method of manufacturing the same
- Patent number 10,342,129
- Issue date Jul 2, 2019
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 9,709,619
- Issue date Jul 18, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- G01 - MEASURING TESTING
Information Patent Grant
Flexible printed board
- Patent number 9,295,155
- Issue date Mar 22, 2016
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,305,767
- Issue date Nov 6, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board
- Patent number 8,269,114
- Issue date Sep 18, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,233,286
- Issue date Jul 31, 2012
- Fujitsu Limited
- Naoki Nakamura
Information Patent Grant
Printed circuit board, fabrication method and apparatus
- Patent number 8,035,978
- Issue date Oct 11, 2011
- Fujitsu Limited
- Shigeru Sugino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING THROUGH HOLE OF SUBSTRATE
- Publication number 20200037452
- Publication date Jan 30, 2020
- Fujitsu Limited
- Kiyoyuki Hatanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING BOARD, ELECTRONIC APPARATUS, METHOD FOR ATTACHING SHEET META...
- Publication number 20190110365
- Publication date Apr 11, 2019
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180310405
- Publication date Oct 25, 2018
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION METHOD OF LAMINATED BOARD, INSPECTION MODULE, AND PALLET
- Publication number 20180059170
- Publication date Mar 1, 2018
- Fujitsu Limited
- Mitsunori ABE
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20170285096
- Publication date Oct 5, 2017
- Fujitsu Limited
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20140077834
- Publication date Mar 20, 2014
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20120312586
- Publication date Dec 13, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...
- Publication number 20110286188
- Publication date Nov 24, 2011
- Fujitsu Limited
- Ryo KANAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...
- Publication number 20110132654
- Publication date Jun 9, 2011
- Fujitsu Limited
- Nobuo TAKETOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20100212938
- Publication date Aug 26, 2010
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD AND APPARATUS
- Publication number 20090080168
- Publication date Mar 26, 2009
- FUJITSU LIMITED
- Shigeru SUGINO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed wiring board reliably achieving electric connection with el...
- Publication number 20080080153
- Publication date Apr 3, 2008
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shigeru Sugino

Person

Patents Grantslast 30 patents

Method of manufacturing through hole of substrate

Wiring board, electronic apparatus, method for attaching sheet meta...

Printed wiring board, crack prediction device, and crack prediction...

Inspection method of laminated board, inspection module, and pallet

Substrate and method of manufacturing the same

Printed wiring board, crack prediction device, and crack prediction...

Flexible printed board

Printed wiring board reliably achieving electric connection with el...

Flexible printed board

Printed wiring board reliably achieving electric connection with el...

Printed circuit board, fabrication method and apparatus

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING THROUGH HOLE OF SUBSTRATE

WIRING BOARD, ELECTRONIC APPARATUS, METHOD FOR ATTACHING SHEET META...

SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

INSPECTION METHOD OF LAMINATED BOARD, INSPECTION MODULE, AND PALLET

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

FLEXIBLE PRINTED BOARD

MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...

MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...

FLEXIBLE PRINTED BOARD

PRINTED CIRCUIT BOARD, FABRICATION METHOD AND APPARATUS

Printed wiring board reliably achieving electric connection with el...