Shigeru Yamane

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing clad board for forming circuitry, clad boar...
- Patent number 7,754,321
- Issue date Jul 13, 2010
- Panasonic Corporation
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing same
- Patent number 6,993,836
- Issue date Feb 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed-circuit board
- Patent number 6,890,449
- Issue date May 10, 2005
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fabricating circuit-forming-substrate and...
- Patent number 6,838,164
- Issue date Jan 4, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing clad board for forming circuitry, clad boar...
- Patent number 6,833,042
- Issue date Dec 21, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fabricating circuit-forming-substrate and...
- Patent number 6,814,836
- Issue date Nov 9, 2004
- Matsushita Electric Industrial, Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board having at least two or more circuit patte...
- Patent number 6,700,071
- Issue date Mar 2, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, and method and apparatus for manufacturing th...
- Patent number 6,671,951
- Issue date Jan 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board and method of manufacturing same
- Patent number 6,528,733
- Issue date Mar 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 6,523,258
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Eiji Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, and method and apparatus for manufacturing th...
- Patent number 6,518,515
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co, LTD
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fabricating circuit-forming-substrate and...
- Patent number 6,409,869
- Issue date Jun 25, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 6,365,844
- Issue date Apr 2, 2002
- Matsushita Electric Industrial Co., Ltd.
- Toshihiro Nishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light receiving module for SCM transmission
- Patent number 5,490,227
- Issue date Feb 6, 1996
- Matsushita Electric Industrial Co., Inc.
- Manabu Tanabe
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
TOUCH INPUT DEVICE AND METHOD OF MANUFACTURING OPERATION PANEL
- Publication number 20240253464
- Publication date Aug 1, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMANE
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method of manufacturing clad board for forming circuitry, clad boar...
- Publication number 20050249933
- Publication date Nov 10, 2005
- Shigeru Yamane
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board and method of manufacturing same
- Publication number 20040035604
- Publication date Feb 26, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production method for conductive paste and production method for pr...
- Publication number 20040020046
- Publication date Feb 5, 2004
- Takeshi Suzuki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Circuit forming board producing method, circuit forming board, and...
- Publication number 20030091787
- Publication date May 15, 2003
- Shigeru Yamane
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board and method of manufacturing same
- Publication number 20020189856
- Publication date Dec 19, 2002
- Toshiaki Takenaka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for manufacturing printed-circuit board
- Publication number 20020170876
- Publication date Nov 21, 2002
- Eiji Kawamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and apparatus for fabricating circuit-forming-substrate and...
- Publication number 20020112815
- Publication date Aug 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and apparatus for fabricating circuit-forming-substrate and...
- Publication number 20020112822
- Publication date Aug 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND...
- Publication number 20020040758
- Publication date Apr 11, 2002
- SHIGERU YAMANE
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Multi-layer circuit board and method of manufacturing same
- Publication number 20020020548
- Publication date Feb 21, 2002
- Toshiaki Takenaka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board, and method and apparatus for manufactujring t...
- Publication number 20020020556
- Publication date Feb 21, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshihiro Nishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board, and method and apparatus for manufacturing th...
- Publication number 20020020557
- Publication date Feb 21, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshihiro Nishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20010032700
- Publication date Oct 25, 2001
- TOSHIHIRO NISHII
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20010025415
- Publication date Oct 4, 2001
- Eiji Kawamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Shigeru Yamane

Person

Patents Grantslast 30 patents

Method of manufacturing clad board for forming circuitry, clad boar...

Circuit board and method of manufacturing same

Method for manufacturing printed-circuit board

Method and apparatus for fabricating circuit-forming-substrate and...

Method of manufacturing clad board for forming circuitry, clad boar...

Method and apparatus for fabricating circuit-forming-substrate and...

Multi-layer circuit board having at least two or more circuit patte...

Printed wiring board, and method and apparatus for manufacturing th...

Multi-layer circuit board and method of manufacturing same

Method of manufacturing printed circuit board

Printed wiring board, and method and apparatus for manufacturing th...

Method and apparatus for fabricating circuit-forming-substrate and...

Printed wiring board

Light receiving module for SCM transmission

Patents Applicationslast 30 patents

TOUCH INPUT DEVICE AND METHOD OF MANUFACTURING OPERATION PANEL

Method of manufacturing clad board for forming circuitry, clad boar...

Circuit board and method of manufacturing same

Production method for conductive paste and production method for pr...

Circuit forming board producing method, circuit forming board, and...

Circuit board and method of manufacturing same

Method for manufacturing printed-circuit board

Method and apparatus for fabricating circuit-forming-substrate and...

Method and apparatus for fabricating circuit-forming-substrate and...

METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND...

Multi-layer circuit board and method of manufacturing same

Printed wiring board, and method and apparatus for manufactujring t...

Printed wiring board, and method and apparatus for manufacturing th...

PRINTED WIRING BOARD

Method of manufacturing printed circuit board