Claims
- 1. An equipment for manufacturing a printed wiring board comprising:a unit for forming a through-hole, or a non-through-hole, in a board material containing an uncured component for a printed wiring board using an energy beam generated by an energy beam generator; means for controlling humidity; a section for feeding printed wiring board material; and a hole-forming section, wherein said means for controlling humidity is located in at least one of the section for feeding such board material and the hole-forming section.
- 2. The equipment for manufacturing a printed wiring board recited in claim 1, whereinsaid means for controlling humidity comprises dehumidifying means.
- 3. The equipment for manufacturing a printed wiring board recited in claim 2, wherein the dehumidifying means comprises a hot air drying unit.
- 4. The equipment for manufacturing a printed wiring board recited in claim 3, wherein the hot air drying unit is set for having a temperature not lower than 50° C., and within a limitation of temperature and time period in which a gel time of board material of such printed wiring board does not substantially shift from a normal value.
- 5. The equipment for manufacturing a printed wiring board recited in claim 2, wherein the dehumidifying means is for dehumidifying at once two or more pieces of board material containing an uncured component.
- 6. The equipment for manufacturing a printed wiring board recited in claim 2, wherein the dehumidifying means is for adjusting a water content to be not more than 1 wt % in a board material containing an uncured component.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-336838 |
Dec 1997 |
JP |
|
Parent Case Info
This is a divisional of application Ser. No. 09/355,455, filed, Sep. 15, 1999, now U.S. Pat. No. 6,409,869, which is a national stage entry of International Application No. PCT/JP98/05481, filed Dec. 4, 1998 designating the U.S., which claims the benefit of Japanese Application No. 9-336838 filed Dec. 8, 1997.
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