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Ayase, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Carriers and polishing apparatus
Patent number
6,273,803
Issue date
Aug 14, 2001
SpeedFam Co., Ltd.
Xu-Jin Wang
B24 - GRINDING POLISHING
Information
Patent Grant
Semiconductor wafer surface flattening apparatus
Patent number
6,062,954
Issue date
May 16, 2000
Speedfam Co., Ltd.
Shigeto Izumi
B24 - GRINDING POLISHING
Information
Patent Grant
Chemical and mechanical polishing apparatus
Patent number
6,030,488
Issue date
Feb 29, 2000
Speedfam Co., Ltd.
Shigeto Izumi
B24 - GRINDING POLISHING
Information
Patent Grant
Carrier and CMP apparatus
Patent number
6,012,964
Issue date
Jan 11, 2000
Speedfam Co., Ltd.
Hatsuyuki Arai
B24 - GRINDING POLISHING
Information
Patent Grant
Apparatus for applying an urging force to a wafer
Patent number
5,916,009
Issue date
Jun 29, 1999
Speedfam Co., Ltd.
Shigeto Izumi
B24 - GRINDING POLISHING