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Shigetoshi Segawa
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Ehime, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate for mounting light-emitting element and light-emitting de...
Patent number
9,076,714
Issue date
Jul 7, 2015
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Seiichi Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit module and manufacturing method thereof
Patent number
8,003,438
Issue date
Aug 23, 2011
Panasonic Corporation
Kenji Morimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Production method of circuit board module
Patent number
6,942,745
Issue date
Sep 13, 2005
Matsushita Electric Industrial Co., Ltd.
Shigetoshi Segawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of producing ceramic multi-layered substrate
Patent number
6,740,183
Issue date
May 25, 2004
Matsushita Electric Industrial Co., Ltd.
Shigetoshi Segawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Sheet retainer for punching ceramic green sheet and punching apparatus
Patent number
6,647,845
Issue date
Nov 18, 2003
Matsushita Electric Industrial Co., Ltd.
Hiroshi Ochi
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method of manufacturing a circuit board using a porous sheet compos...
Patent number
6,598,292
Issue date
Jul 29, 2003
Matsushita Electric Industrial Co., Ltd.
Shigetoshi Segawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a multi-layered ceramic substrate
Patent number
6,350,334
Issue date
Feb 26, 2002
Matsushita Electric Industrial Co., Ltd.
Jun Shigemi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE...
Publication number
20120319159
Publication date
Dec 20, 2012
Seiichi Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SUBSTRATE AND METHOD FOR PRODUCING THE SAME
Publication number
20110293874
Publication date
Dec 1, 2011
Takashi TOYOOKA
B32 - LAYERED PRODUCTS
Information
Patent Application
Circuit module and manufacturing method thereof
Publication number
20080090335
Publication date
Apr 17, 2008
Matsushita Electric Industrial Co., Ltd.
Kenji Morimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit board
Publication number
20050029011
Publication date
Feb 10, 2005
Matsushita Electric Industrial Co., Ltd.
Toshifumi Morita
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Circuit module and manufacturing method thereof
Publication number
20050017347
Publication date
Jan 27, 2005
Matsushita Electric Industrial Co., Ltd.
Kenji Morimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Production method of circuit board module
Publication number
20030034127
Publication date
Feb 20, 2003
Shigetoshi Segawa
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC