Shih-Chin Gong

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure of micro speaker and method for forming the same
- Patent number 12,170,877
- Issue date Dec 17, 2024
- FORTEMEDIA, INC.
- Yu-Xuan Xu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for touchless gesture recognition, and apparatuses using the...
- Patent number 11,995,246
- Issue date May 28, 2024
- FORTEMEDIA, INC.
- Yu-Xuan Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure of micro speaker and method for forming the same
- Patent number 11,818,563
- Issue date Nov 14, 2023
- FORTEMEDIA, INC.
- Li-Jen Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure of micro speaker
- Patent number 11,665,484
- Issue date May 30, 2023
- FORTEMEDIA, INC.
- Li-Jen Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Movable embedded microstructure
- Patent number 11,051,106
- Issue date Jun 29, 2021
- Fortemedia, Inc.
- Li-Jen Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic apparatus and controlling method thereof
- Patent number 9,439,309
- Issue date Sep 6, 2016
- Compal Electronics, Inc.
- Chun-Te Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable electronic device and cradle
- Patent number 9,137,913
- Issue date Sep 15, 2015
- Compal Electronics, Inc.
- Wei-Chih Hsu
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Silicon-based microphone structure with electromagnetic interferenc...
- Patent number 8,351,635
- Issue date Jan 8, 2013
- Fortemedia, Inc.
- Chih Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone package with minimum footprint size and thickness
- Patent number 8,102,015
- Issue date Jan 24, 2012
- Fortemedia, Inc.
- Shih-Chin Gong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of maintaining photolithographic precision alignment after w...
- Patent number 6,967,145
- Issue date Nov 22, 2005
- Asia Pacific Microsystems, Inc.
- Chung-Yang Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication process for bonded wafer precision layer thickness cont...
- Patent number 6,864,176
- Issue date Mar 8, 2005
- Asia Pacific Microsystems, Inc.
- Hung-Dar Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon pressure sensor and the manufacturing method thereof
- Patent number 6,838,303
- Issue date Jan 4, 2005
- Asia Pacific Microsystems, Inc.
- Hung-Dar Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MICRO SPEAKER STRUCTURE WITH NOVEL MAGNET DESIGN
- Publication number 20250008270
- Publication date Jan 2, 2025
- Fortemedia, Inc.
- Shih-Chin GONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE OF MICRO SPEAKER
- Publication number 20240357294
- Publication date Oct 24, 2024
- Fortemedia, Inc.
- Yu-Xuan XU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE OF MICRO SPEAKER AND METHOD FOR FORMING THE SAME
- Publication number 20240196134
- Publication date Jun 13, 2024
- Fortemedia, Inc.
- Yu-Xuan XU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR TOUCHLESS GESTURE RECOGNITION, AND APPARATUSES USING THE...
- Publication number 20240126374
- Publication date Apr 18, 2024
- Fortemedia, Inc.
- Yu-Xuan XU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRUE WIRELESS DEVICE AND DUAL-MODE TRUE WIRELESS DEVICE
- Publication number 20240121545
- Publication date Apr 11, 2024
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF MICRO SPEAKER
- Publication number 20240007793
- Publication date Jan 4, 2024
- Fortemedia, Inc.
- Yu-Xuan XU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE OF MICRO SPEAKER AND METHOD FOR FORMING THE SAME
- Publication number 20230239628
- Publication date Jul 27, 2023
- Fortemedia, Inc.
- Li-Jen CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF MICRO SPEAKER
- Publication number 20220141595
- Publication date May 5, 2022
- Fortemedia, Inc.
- Li-Jen CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOVABLE EMBEDDED MICROSTRUCTURE
- Publication number 20200344551
- Publication date Oct 29, 2020
- Fortemedia, Inc.
- Li-Jen CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF
- Publication number 20140049147
- Publication date Feb 20, 2014
- Compal Electronics, Inc.
- Chun-Te Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PORTABLE ELECTRONIC DEVICE AND CRADLE
- Publication number 20130301201
- Publication date Nov 14, 2013
- Compal Electronics, Inc.
- Wei-Chih Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON-BASED MICROPHONE STRUCTURE WITH ELECTROMAGNETIC INTERFERENC...
- Publication number 20100111344
- Publication date May 6, 2010
- ForteMedia, Inc.
- Chih Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE PACKAGE WITH MINIMUM FOOTPRINT SIZE AND THICKNESS
- Publication number 20100086164
- Publication date Apr 8, 2010
- ForteMedia, Inc.
- Shih-Chin GONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON-BASED MICROPHONE PACKAGE
- Publication number 20100086146
- Publication date Apr 8, 2010
- ForteMedia, Inc.
- Shih-Chin GONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM PACKAGE
- Publication number 20080083958
- Publication date Apr 10, 2008
- Wen-Chieh Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM PACKAGE
- Publication number 20080083957
- Publication date Apr 10, 2008
- Wen-Chieh Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON CONDENSER MICROPHONE
- Publication number 20080075308
- Publication date Mar 27, 2008
- Wen-Chieh Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20080042223
- Publication date Feb 21, 2008
- Lu-Lee Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of making silicon-based miniaturized microphones
- Publication number 20060291674
- Publication date Dec 28, 2006
- Merry Electronics Co. Ltd.
- Shih-Chin Gong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of maintaining photolithographic precision alignment after w...
- Publication number 20050013019
- Publication date Jan 20, 2005
- ASIA PACIFIC MICROSYSTEMS, INC.
- Chung-Yang Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon pressure sensor and the manufacturing method thereof
- Publication number 20040183150
- Publication date Sep 23, 2004
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Dar Wang
- G01 - MEASURING TESTING
Information Patent Application
Fabrication process for bonded wafer precision layer thickness cont...
- Publication number 20030224610
- Publication date Dec 4, 2003
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Dar Wang
- B24 - GRINDING POLISHING

Shih-Chin Gong

Person

Patents Grantslast 30 patents

Package structure of micro speaker and method for forming the same

Method for touchless gesture recognition, and apparatuses using the...

Package structure of micro speaker and method for forming the same

Package structure of micro speaker

Movable embedded microstructure

Electronic apparatus and controlling method thereof

Portable electronic device and cradle

Silicon-based microphone structure with electromagnetic interferenc...

Microphone package with minimum footprint size and thickness

Method of maintaining photolithographic precision alignment after w...

Fabrication process for bonded wafer precision layer thickness cont...

Silicon pressure sensor and the manufacturing method thereof

Patents Applicationslast 30 patents

MICRO SPEAKER STRUCTURE WITH NOVEL MAGNET DESIGN

PACKAGE STRUCTURE OF MICRO SPEAKER

PACKAGE STRUCTURE OF MICRO SPEAKER AND METHOD FOR FORMING THE SAME

METHOD FOR TOUCHLESS GESTURE RECOGNITION, AND APPARATUSES USING THE...

TRUE WIRELESS DEVICE AND DUAL-MODE TRUE WIRELESS DEVICE

PACKAGE STRUCTURE OF MICRO SPEAKER

PACKAGE STRUCTURE OF MICRO SPEAKER AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE OF MICRO SPEAKER

MOVABLE EMBEDDED MICROSTRUCTURE

ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF

PORTABLE ELECTRONIC DEVICE AND CRADLE

SILICON-BASED MICROPHONE STRUCTURE WITH ELECTROMAGNETIC INTERFERENC...

MICROPHONE PACKAGE WITH MINIMUM FOOTPRINT SIZE AND THICKNESS

SILICON-BASED MICROPHONE PACKAGE

MICRO-ELECTROMECHANICAL SYSTEM PACKAGE

MICRO-ELECTROMECHANICAL SYSTEM PACKAGE

SILICON CONDENSER MICROPHONE

MICROELECTROMECHANICAL SYSTEM PACKAGE AND METHOD FOR MAKING THE SAME

Method of making silicon-based miniaturized microphones

Method of maintaining photolithographic precision alignment after w...

Silicon pressure sensor and the manufacturing method thereof

Fabrication process for bonded wafer precision layer thickness cont...