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Taichung City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
PVD target design and semiconductor devices formed using the same
Patent number
11,725,270
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Hsi Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Interconnect structure and method of forming the same
Patent number
11,664,308
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
11,502,050
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with adhesion layer
Patent number
11,177,365
Issue date
Nov 16, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with adhesion layer and method of making
Patent number
11,164,957
Issue date
Nov 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for fabricating a semiconductor device with target sputte...
Patent number
11,081,341
Issue date
Aug 3, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with insulation layer and method of forming...
Patent number
10,923,416
Issue date
Feb 16, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
10,916,517
Issue date
Feb 9, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
10,658,315
Issue date
May 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor device with adhesion layer
Patent number
10,490,649
Issue date
Nov 26, 2019
Taiwan Semiconductor Manufacturing Company, Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing metal gate overhang by forming a top-wide bottom-narrow du...
Patent number
10,446,662
Issue date
Oct 15, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad process with protective layer
Patent number
10,354,965
Issue date
Jul 16, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process kit of physical vapor deposition chamber and fabricating me...
Patent number
9,803,274
Issue date
Oct 31, 2017
Taiwan Semiconductor Manufacturing Co., Ltd
Shih-Wei Bih
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230253309
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20230072507
Publication date
Mar 9, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reducing Metal Gate Overhang By Forming A Top-Wide Bottom-Narrow Du...
Publication number
20210280692
Publication date
Sep 9, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
Publication number
20210238731
Publication date
Aug 5, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Hsi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20210159196
Publication date
May 27, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20210143098
Publication date
May 13, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20200144208
Publication date
May 7, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ADHESION LAYER
Publication number
20200098892
Publication date
Mar 26, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ADHESION LAYER AND METHOD OF MAKING
Publication number
20200098891
Publication date
Mar 26, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR FABRICATING A SEMICONDUCTOR DEVICE WITH TARGET SPUTTE...
Publication number
20200035487
Publication date
Jan 30, 2020
Taiwan Semiconductor Manufacturing company Ltd.
SHIH WEI BIH
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Redistribution Layer Metallic Structure and Method
Publication number
20190304939
Publication date
Oct 3, 2019
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Pad Process with Protective Layer
Publication number
20190096834
Publication date
Mar 28, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20190067188
Publication date
Feb 28, 2019
Taiwan Semiconductor Manufacturing Co., LTD
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FRABRICCATING SEMICONDUCTOR DEVICE WITH ADHESION LAYER
Publication number
20180350946
Publication date
Dec 6, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih Wei BIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING METAL GATE OVERHANG BY FORMING A TOP-WIDE BOTTOM-NARROW DU...
Publication number
20180350948
Publication date
Dec 6, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING METAL GATE OVERHANG BY FORMING A TOP-WIDE BOTTOM-NARROW DU...
Publication number
20180102418
Publication date
Apr 12, 2018
Taiwan Semiconductor Manufacturing Co., LTD
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS KIT OF PHYSICAL VAPOR DEPOSITION CHAMBER AND FABRICATING ME...
Publication number
20150129414
Publication date
May 14, 2015
Taiwan Semiconductor Manufacturing Co., Ltd.
Shih-Wei BIH
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...