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Shih-Yi LEE
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Taoyuan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Chip package and fabrication method thereof
Patent number
9,831,185
Issue date
Nov 28, 2017
Xintec Inc.
Shih-Yi Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating chip package with laser
Patent number
9,780,050
Issue date
Oct 3, 2017
Xintec Inc.
Ying-Nan Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
9,768,067
Issue date
Sep 19, 2017
Xintec Inc.
Chien-Hung Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package having a laser stop structure
Patent number
9,640,405
Issue date
May 2, 2017
Xintec Inc.
Ying-Nan Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package having a dual through hole redistribution layer structure
Patent number
9,543,233
Issue date
Jan 10, 2017
Xintec Inc.
Chien-Hung Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitive coupler packaging structure
Patent number
8,791,768
Issue date
Jul 29, 2014
Ho-Yin Yiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for forming the same
Patent number
8,614,488
Issue date
Dec 24, 2013
Ying-Nan Wen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20170076981
Publication date
Mar 16, 2017
XINTEC INC.
Chien-Hung LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20170047300
Publication date
Feb 16, 2017
XINTEC INC.
Ying-Nan WEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20160322305
Publication date
Nov 3, 2016
XINTEC INC.
Shih-Yi LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20160204061
Publication date
Jul 14, 2016
XINTEC INC.
Ho-Yin YIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20160190063
Publication date
Jun 30, 2016
XINTEC INC.
Ying-Nan WEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20160133544
Publication date
May 12, 2016
XINTEC INC.
Chien-Hung LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20160133588
Publication date
May 12, 2016
XINTEC INC.
Ho-Yin YIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITIVE COUPLER PACKAGING STRUCTURE
Publication number
20120194301
Publication date
Aug 2, 2012
Ho-Yin YIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20120146153
Publication date
Jun 14, 2012
Ying-Nan WEN
H01 - BASIC ELECTRIC ELEMENTS