Shih-Yi Syu

Person

Daxi Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 11,848,247
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 11,037,854
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 10,535,580
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 10,290,559
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 9,490,190
- Issue date Nov 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and formation methods of packages with heat sinks
- Patent number 8,816,495
- Issue date Aug 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for de-bonding carriers
- Patent number 8,629,043
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20200152543
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20190267305
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20170053849
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20140084476
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Formation Methods of Packages with Heat Sinks
- Publication number 20130217188
- Publication date Aug 22, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for De-Bonding Carriers
- Publication number 20130122689
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Shih-Yi Syu

Person

Patents Grantslast 30 patents

Thermal dissipation through seal rings in 3DIC structure

Thermal dissipation through seal rings in 3DIC structure

Thermal dissipation through seal rings in 3DIC structure

Thermal dissipation through seal rings in 3DIC structure

Thermal dissipation through seal rings in 3DIC structure

Structures and formation methods of packages with heat sinks

Methods for de-bonding carriers

Patents Applicationslast 30 patents

Thermal Dissipation Through Seal Rings in 3DIC Structure

Thermal Dissipation Through Seal Rings in 3DIC Structure

Thermal Dissipation Through Seal Rings in 3DIC Structure

Thermal Dissipation Through Seal Rings in 3DIC Structure

Structures and Formation Methods of Packages with Heat Sinks

Methods for De-Bonding Carriers