Shin-Mao Huang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 12,074,137
- Issue date Aug 27, 2024
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,587,905
- Issue date Feb 21, 2023
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and manufacturing method thereof
- Patent number 11,569,217
- Issue date Jan 31, 2023
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacture method thereof
- Patent number 11,424,190
- Issue date Aug 23, 2022
- Industrial Technology Research Institute
- Chao-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and manufacturing method thereof
- Patent number 11,251,174
- Issue date Feb 15, 2022
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device substrate
- Patent number 11,056,512
- Issue date Jul 6, 2021
- Au Optronics Corporation
- Shin-Wei Huang
- G02 - OPTICS
Information Patent Grant
Display panel
- Patent number 10,991,728
- Issue date Apr 27, 2021
- Au Optronics Corporation
- Shin-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package module and circuit board structure comprising the same
- Patent number 10,490,473
- Issue date Nov 26, 2019
- Industrial Technology Research Institute
- Shin-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and backlight module used therein
- Patent number 10,126,490
- Issue date Nov 13, 2018
- AU OPTRONICS CORPORATION
- Wei-Shyang Wang
- G02 - OPTICS
Information Patent Grant
Method for forming semiconductor device structure
- Patent number 9,871,137
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yeh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor
- Patent number 9,716,091
- Issue date Jul 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure
- Patent number 9,478,617
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yeh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor
- Patent number 9,379,215
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor
- Patent number 9,209,300
- Issue date Dec 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 9,202,916
- Issue date Dec 1, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yeh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for high/low voltage insulation
- Patent number 9,143,243
- Issue date Sep 22, 2015
- Industrial Technology Research Institute
- Shin-Yi Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package structure
- Patent number 8,866,309
- Issue date Oct 21, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin held effect transistor
- Patent number 8,809,940
- Issue date Aug 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for high capacitance capacitor structure
- Patent number 8,557,673
- Issue date Oct 15, 2013
- Inotera Memories, Inc.
- Shin-Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET and method of fabricating the same
- Patent number 8,440,517
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for preventing current-leakage
- Patent number 8,330,198
- Issue date Dec 11, 2012
- Inotera Memories, Inc.
- Shin Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for managing a non-violate memory and computer readable medi...
- Patent number 8,296,506
- Issue date Oct 23, 2012
- Lite-On It Corporation
- Tsung-Hsi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing capacitor lower electrodes of semiconducto...
- Patent number 8,288,224
- Issue date Oct 16, 2012
- Inotera Memories, Inc.
- Shin-Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile data storage system and method thereof
- Patent number 8,156,278
- Issue date Apr 10, 2012
- Industrial Technology Research Institute
- Guo-Zua Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Nonvolatile memory cell
- Patent number 8,148,766
- Issue date Apr 3, 2012
- Nanya Technology Corp.
- Shin-Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing capacitor lower electrodes of semiconducto...
- Patent number 8,088,668
- Issue date Jan 3, 2012
- Inotera Memories, Inc.
- Shin Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process using oxide supporter for manufacturing a capacitor lower e...
- Patent number 8,003,480
- Issue date Aug 23, 2011
- Inotera Memories, Inc.
- Shin Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for double-side capacitor of stack DRAM
- Patent number 7,960,241
- Issue date Jun 14, 2011
- Inotera Memories, Inc.
- Shin-Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout and structure of memory
- Patent number 7,868,377
- Issue date Jan 11, 2011
- Nanya Technology Corp.
- Shin-Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187409
- Publication date Jun 15, 2023
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220130812
- Publication date Apr 28, 2022
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118860
- Publication date Apr 22, 2021
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111126
- Publication date Apr 15, 2021
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURE METHOD THEREOF
- Publication number 20210111125
- Publication date Apr 15, 2021
- Industrial Technology Research Institute
- Chao-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111153
- Publication date Apr 15, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE SUBSTRATE
- Publication number 20200168632
- Publication date May 28, 2020
- AU OPTRONICS CORPORATION
- Shin-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20200166793
- Publication date May 28, 2020
- AU OPTRONICS CORPORATION
- Shin-Wei Huang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200083332
- Publication date Mar 12, 2020
- Industrial Technology Research Institute
- Heng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE AND CIRCUIT BOARD STRUCTURE COMPRISING THE SAME
- Publication number 20190237373
- Publication date Aug 1, 2019
- Industrial Technology Research Institute
- Shin-Yi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND BACKLIGHT MODULE USED THEREIN
- Publication number 20170276866
- Publication date Sep 28, 2017
- AU OPTRONICS CORPORATION
- WEI-SHYANG WANG
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20170040451
- Publication date Feb 9, 2017
- TAIWAN SEMICONDUCTOR MANUFACTURING CO.,
- Shin-Yeh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR
- Publication number 20160379977
- Publication date Dec 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR
- Publication number 20160087079
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20160064486
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yeh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150187940
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yeh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION
- Publication number 20140374629
- Publication date Dec 25, 2014
- Industrial Technology Research Institute
- Shin-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR
- Publication number 20140327091
- Publication date Nov 6, 2014
- Hung-Ta LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR HIGH CAPACITANCE CAPACITOR STRUCTURE
- Publication number 20130252397
- Publication date Sep 26, 2013
- INOTERA MEMORIES, INC.
- SHIN-BIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR
- Publication number 20130228865
- Publication date Sep 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20130168798
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE PROCESS AND CHIP PACKAGE STRUCTURE
- Publication number 20130043599
- Publication date Feb 21, 2013
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET AND METHOD OF FABRICATING THE SAME
- Publication number 20120091538
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ta LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PREVENTING CURRENT-LEAKAGE
- Publication number 20110127574
- Publication date Jun 2, 2011
- INOTERA MEMORIES, INC.
- SHIN BIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Managing a Non-Violate Memory and Computer Readable Medi...
- Publication number 20110113183
- Publication date May 12, 2011
- Industrial Technology Research Institute
- Tsung-Hsi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR LOWER ELECTRODES OF SEMICONDUCTO...
- Publication number 20110092044
- Publication date Apr 21, 2011
- INOTERA MEMORIES, INC.
- SHIN-BIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ELECTRODE, CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20110090617
- Publication date Apr 21, 2011
- Shin-Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDE IMPLANTING PROCESS FOR CAPACITORS OF STACK DRAM
- Publication number 20110086490
- Publication date Apr 14, 2011
- INOTERA MEMORIES, INC.
- HSIAO-LEI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS USING OXIDE SUPPORTER FOR MANUFACTURING A CAPACITOR LOWER E...
- Publication number 20110081763
- Publication date Apr 7, 2011
- INOTERA MEMORIES, INC.
- SHIN BIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR LOWER ELECTRODES OF SEMICONDUCTO...
- Publication number 20110076828
- Publication date Mar 31, 2011
- INOTERA MEMORIES, INC.
- SHIN BIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Shin-Mao Huang

Person

Patents Grantslast 30 patents

Multi-chip package and manufacturing method thereof

Multi-chip package and manufacturing method thereof

Multi-chip package and manufacturing method thereof

Image sensor package and manufacturing method thereof

Multi-chip package and manufacture method thereof

Image sensor package and manufacturing method thereof

Device substrate

Display panel

Chip package module and circuit board structure comprising the same

Display device and backlight module used therein

Method for forming semiconductor device structure

Fin field effect transistor

Method for forming semiconductor device structure

Fin field effect transistor

Fin field effect transistor

Semiconductor device structure

Power module for high/low voltage insulation

Chip package structure

Fin held effect transistor

Manufacturing method for high capacitance capacitor structure

FinFET and method of fabricating the same

Device for preventing current-leakage

Method for managing a non-violate memory and computer readable medi...

Method for manufacturing capacitor lower electrodes of semiconducto...

Non-volatile data storage system and method thereof

Nonvolatile memory cell

Method for manufacturing capacitor lower electrodes of semiconducto...

Process using oxide supporter for manufacturing a capacitor lower e...

Manufacturing method for double-side capacitor of stack DRAM

Layout and structure of memory

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP PACKAGE AND MANUFACTURE METHOD THEREOF

MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

DEVICE SUBSTRATE

DISPLAY PANEL

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE MODULE AND CIRCUIT BOARD STRUCTURE COMPRISING THE SAME

DISPLAY DEVICE AND BACKLIGHT MODULE USED THEREIN

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

FIN FIELD EFFECT TRANSISTOR

FIN FIELD EFFECT TRANSISTOR

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION

FIN FIELD EFFECT TRANSISTOR

MANUFACTURING METHOD FOR HIGH CAPACITANCE CAPACITOR STRUCTURE

FIN FIELD EFFECT TRANSISTOR

CHIP PACKAGE STRUCTURE

CHIP PACKAGE PROCESS AND CHIP PACKAGE STRUCTURE

FINFET AND METHOD OF FABRICATING THE SAME

DEVICE FOR PREVENTING CURRENT-LEAKAGE

Method for Managing a Non-Violate Memory and Computer Readable Medi...

METHOD FOR MANUFACTURING CAPACITOR LOWER ELECTRODES OF SEMICONDUCTO...

CAPACITOR ELECTRODE, CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME

SINGLE-SIDE IMPLANTING PROCESS FOR CAPACITORS OF STACK DRAM

PROCESS USING OXIDE SUPPORTER FOR MANUFACTURING A CAPACITOR LOWER E...

METHOD FOR MANUFACTURING CAPACITOR LOWER ELECTRODES OF SEMICONDUCTO...