Shin Nakao

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 6,191,493
- Issue date Feb 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 5,920,770
- Issue date Jul 6, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,753,973
- Issue date May 19, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,656,863
- Issue date Aug 12, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier for semiconductor apparatus
- Patent number 5,366,794
- Issue date Nov 22, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Shin Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,016,084
- Issue date May 14, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Shin Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a dimensionally stable semiconductor device
- Patent number 4,654,966
- Issue date Apr 7, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Masanobu Kohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimensionally stable semiconductor device
- Patent number 4,561,011
- Issue date Dec 24, 1985
- Mitsubishi Denki Kabushiki Kaisha
- Masanobu Kohara
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Resin seal semiconductor package and manufacturing method of the same

Resin seal semiconductor package and manufacturing method of the same

Resin seal semiconductor package

Resin seal semiconductor package

Tape carrier for semiconductor apparatus

Semiconductor device

Method of making a dimensionally stable semiconductor device

Dimensionally stable semiconductor device