Gupta, O. R., Inner Fin Air Cooled Module, IBM Technical Disclosure Bulletin, vol. 19, No. 5, (10/76). |
Koopman et al., Solid State Expanding Alloys for Chip Thermal Connection, IBM Tech. Disc. Bull., vol. 19, No. 9, (2/1977). |
Hultmark et al., Dimensional Control for Semiconductor Package, IBM Technical Disclosure Bulletin, vol. 21, No. 7, (12/78). |
Arnold et al., Module with Internal Elements for Reducing Thermal Resistance, IBM Tech. Disc. Bull., vol. 21, No. 4, (9/1978). |
Doo et al., Controlled Gap in Semiconductor Packages, IBM Technical Disclosure Bulletin, vol. 20, No. 4, (9/77). |
Lynch, J. R., Air and Liquid Drop Cooled Module, IBM Tech. Disc. Bull., vol. 22, No. 1, (6/1978). |