Shin Takanezawa

Person

Chikusei-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Prepreg for coreless substrate, coreless substrate and semiconducto...
- Patent number 11,581,212
- Issue date Feb 14, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Hiroshi Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer insulating film and method for producing same
- Patent number 11,432,400
- Issue date Aug 30, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Masaharu Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Modified silicone compound, and thermosetting resin composition, pr...
- Patent number 11,401,381
- Issue date Aug 2, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiko Kotake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Support-provided insulating layer, laminate, and wiring board
- Patent number 11,319,457
- Issue date May 3, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Masaki Morita
- B32 - LAYERED PRODUCTS
Information Patent Grant
Coreless substrate prepreg, coreless substrate, coreless substrate...
- Patent number 10,681,807
- Issue date Jun 9, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Varnish, prepreg, film with resin, metal foil-clad laminate, and pr...
- Patent number 10,465,089
- Issue date Nov 5, 2019
- Hitachi Chemical Company, Ltd.
- Kouji Morita
- B32 - LAYERED PRODUCTS
Information Patent Grant
Siloxane compound, modified imide resin, thermosetting resin compos...
- Patent number 10,323,126
- Issue date Jun 18, 2019
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, and prepreg, insulating film with...
- Patent number 10,119,047
- Issue date Nov 6, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Varnish, prepreg, film with resin, metal foil-clad laminate, and pr...
- Patent number 9,265,145
- Issue date Feb 16, 2016
- Hitachi Chemical Company, Ltd.
- Kouji Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, and printed wiring board, laminated sheet, and p...
- Patent number 9,133,308
- Issue date Sep 15, 2015
- Hitachi Chemical Company, Ltd.
- Shunsuke Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, laminate obtained with the same and printed-wiring board
- Patent number 9,079,376
- Issue date Jul 14, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, laminate, and wiring board
- Patent number 9,078,365
- Issue date Jul 7, 2015
- Hitachi Chemical Co., Ltd.
- Koji Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 8,815,334
- Issue date Aug 26, 2014
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg laminate obtained with the same and prin...
- Patent number 8,735,733
- Issue date May 27, 2014
- Hitachi Chemical Company, Ltd.
- Masato Miyatake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,862,889
- Issue date Jan 4, 2011
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent fitted metal foil, and printed wiring boar...
- Patent number 7,740,936
- Issue date Jun 22, 2010
- Hitachi Chemical Co., Ltd.
- Nobuyuki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation material, film, circuit board and method of producing them
- Patent number 7,700,185
- Issue date Apr 20, 2010
- Hitachi Chemical Company, Ltd.
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,629,045
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing an insulating resin composition, insulating re...
- Patent number 7,572,503
- Issue date Aug 11, 2009
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing an insulating resin composition, insulating re...
- Patent number 6,979,712
- Issue date Dec 27, 2005
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition which can be cured by application of heat or irra...
- Patent number 6,156,870
- Issue date Dec 5, 2000
- Hitachi Chemical Company, Ltd.
- Masaki Morita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and its use in production of multilayer printed c...
- Patent number 5,935,452
- Issue date Aug 10, 1999
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer printed circuit board with epoxy resin and carboxylated...
- Patent number 5,874,009
- Issue date Feb 23, 1999
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive for printed wiring board and production thereof
- Patent number 5,419,946
- Issue date May 30, 1995
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for producing printed wiring board
- Patent number 5,309,632
- Issue date May 10, 1994
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring boards
- Patent number 5,153,987
- Issue date Oct 13, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for printed wiring boards with acrylonitrile-b...
- Patent number 5,053,280
- Issue date Oct 1, 1991
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesive clad insulating substrate used for producing printed circu...
- Patent number 4,837,086
- Issue date Jun 6, 1989
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...
- Publication number 20200404783
- Publication date Dec 24, 2020
- Hitachi Chemical Company, Ltd.
- Mari SHIMIZU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...
- Publication number 20200107437
- Publication date Apr 2, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko SAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...
- Publication number 20200056006
- Publication date Feb 20, 2020
- Hitachi Chemical Company, Ltd.
- Hiroshi YOKOTA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTU...
- Publication number 20190218415
- Publication date Jul 18, 2019
- Hitachi Chemical Company, Ltd.
- Masaki MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERLAYER INSULATING FILM AND METHOD FOR PRODUCING SAME
- Publication number 20190182953
- Publication date Jun 13, 2019
- Hitachi Chemical Company, Ltd.
- Masaharu MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PR...
- Publication number 20190002728
- Publication date Jan 3, 2019
- Hitachi Chemical Company, Ltd.
- Kouji MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PR...
- Publication number 20160083614
- Publication date Mar 24, 2016
- Hitachi Chemical Company, Ltd.
- Kouji MORITA
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermosetting Resin Composition, and Prepreg, Insulating Film With...
- Publication number 20150203715
- Publication date Jul 23, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiko KOTAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MODIFIED SILOXANE COMPOUND HAVING AROMATIC AZOMETHINE, THERMOSETTIN...
- Publication number 20140192501
- Publication date Jul 10, 2014
- Hitachi Chemical Company, Ltd.
- Tomohiko KOTAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND P...
- Publication number 20140000948
- Publication date Jan 2, 2014
- Shunsuke Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PR...
- Publication number 20130330563
- Publication date Dec 12, 2013
- Hitachi Chemical Company, Ltd.
- Tomohiko Kotake
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTU...
- Publication number 20130199830
- Publication date Aug 8, 2013
- Hitachi Chemical Company Ltd.
- Masaki Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PR...
- Publication number 20130008695
- Publication date Jan 10, 2013
- Kouji Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRIN...
- Publication number 20120247820
- Publication date Oct 4, 2012
- Masato MIYATAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD
- Publication number 20120237751
- Publication date Sep 20, 2012
- Tomohiko KOTAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PROD...
- Publication number 20120077401
- Publication date Mar 29, 2012
- Tomohiko Kotake
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20100051338
- Publication date Mar 4, 2010
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE, AND WIRING BOARD
- Publication number 20090200071
- Publication date Aug 13, 2009
- Hitachi Chemical Co., Ltd.
- Koji Morita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20090145766
- Publication date Jun 11, 2009
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Boar...
- Publication number 20080145689
- Publication date Jun 19, 2008
- Nobuyuki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation material, film, circuit board and method of producing them
- Publication number 20070060672
- Publication date Mar 15, 2007
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing an insulating resin composition, insulating re...
- Publication number 20050255270
- Publication date Nov 17, 2005
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Publication number 20050202261
- Publication date Sep 15, 2005
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing an insulating resin composition, insulating re...
- Publication number 20040161612
- Publication date Aug 19, 2004
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shin Takanezawa

Person

Patents Grantslast 30 patents

Prepreg for coreless substrate, coreless substrate and semiconducto...

Interlayer insulating film and method for producing same

Modified silicone compound, and thermosetting resin composition, pr...

Support-provided insulating layer, laminate, and wiring board

Coreless substrate prepreg, coreless substrate, coreless substrate...

Varnish, prepreg, film with resin, metal foil-clad laminate, and pr...

Siloxane compound, modified imide resin, thermosetting resin compos...

Thermosetting resin composition, and prepreg, insulating film with...

Varnish, prepreg, film with resin, metal foil-clad laminate, and pr...

Resin composition, and printed wiring board, laminated sheet, and p...

Prepreg, laminate obtained with the same and printed-wiring board

Resin composition, prepreg, laminate, and wiring board

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Resin composition, prepreg laminate obtained with the same and prin...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Adhesion assisting agent fitted metal foil, and printed wiring boar...

Insulation material, film, circuit board and method of producing them

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Method for preparing an insulating resin composition, insulating re...

Method for preparing an insulating resin composition, insulating re...

Resin composition which can be cured by application of heat or irra...

Resin composition and its use in production of multilayer printed c...

Multilayer printed circuit board with epoxy resin and carboxylated...

Adhesive for printed wiring board and production thereof

Process for producing printed wiring board

Process for producing printed wiring boards

Adhesive composition for printed wiring boards with acrylonitrile-b...

Adhesive clad insulating substrate used for producing printed circu...

Patents Applicationslast 30 patents

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...

CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...

PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTO...

RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTU...

INTERLAYER INSULATING FILM AND METHOD FOR PRODUCING SAME

VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PR...

VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PR...

Thermosetting Resin Composition, and Prepreg, Insulating Film With...

MODIFIED SILOXANE COMPOUND HAVING AROMATIC AZOMETHINE, THERMOSETTIN...

RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND P...

MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PR...

RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTU...

VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PR...

RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRIN...

PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD

RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PROD...

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

RESIN COMPOSITION, PREPREG, LAMINATE, AND WIRING BOARD

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Boar...

Insulation material, film, circuit board and method of producing them

Method for preparing an insulating resin composition, insulating re...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Method for preparing an insulating resin composition, insulating re...