Shingo Komatsu

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Field-effect transistor and method for manufacturing the same
- Patent number 8,871,567
- Issue date Oct 28, 2014
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a semiconductor device on a flexible substrate
- Patent number 8,617,943
- Issue date Dec 31, 2013
- Panasonic Corporation
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing process thereof
- Patent number 8,344,264
- Issue date Jan 1, 2013
- Panasonic Corporation
- Yutaka Kumano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 8,039,307
- Issue date Oct 18, 2011
- Panasonic Corporation
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of flexible semiconductor device and flexible...
- Patent number 7,977,741
- Issue date Jul 12, 2011
- Panasonic Corporation
- Koichi Hirano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component mounting method
- Patent number 7,921,551
- Issue date Apr 12, 2011
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 7,911,064
- Issue date Mar 22, 2011
- Panasonic Corporation
- Shingo Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer material used for producing a wiring substrate
- Patent number 7,888,789
- Issue date Feb 15, 2011
- Panasonic Corporation
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of flexible semiconductor device and flexible...
- Patent number 7,851,281
- Issue date Dec 14, 2010
- Panasonic Corporation
- Koichi Hirano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounted body and method for manufacturing the same
- Patent number 7,713,787
- Issue date May 11, 2010
- Panasonic Corporation
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bump and method for mounting semiconducto...
- Patent number 7,611,040
- Issue date Nov 3, 2009
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,390,692
- Issue date Jun 24, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 7,294,587
- Issue date Nov 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 7,198,996
- Issue date Apr 3, 2007
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,157,789
- Issue date Jan 2, 2007
- Matsushita Electric Industrial Co., Ltd.
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,132,756
- Issue date Nov 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component built-in module with embedded semiconductor chip...
- Patent number 7,018,866
- Issue date Mar 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 6,975,516
- Issue date Dec 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component built-in module
- Patent number 6,955,948
- Issue date Oct 18, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 6,939,738
- Issue date Sep 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate produced by transfer material method
- Patent number 6,936,774
- Issue date Aug 30, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer material for wiring substrate
- Patent number 6,871,396
- Issue date Mar 29, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation sheet, multi-layer wiring substrate and production proce...
- Patent number 6,855,892
- Issue date Feb 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shingo Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component built-in module with embedded semiconductor chip...
- Patent number 6,784,530
- Issue date Aug 31, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method for producing the same
- Patent number 6,734,542
- Issue date May 11, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module and method of manufacturing the same
- Patent number 6,489,685
- Issue date Dec 3, 2002
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130032797
- Publication date Feb 7, 2013
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE...
- Publication number 20110049598
- Publication date Mar 3, 2011
- PANASONIC CORPORATION
- Koichi HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FLEXIBLE SEMICONDUCTOR DEVICE AND LAYERED FI...
- Publication number 20100276691
- Publication date Nov 4, 2010
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100224986
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE...
- Publication number 20100012936
- Publication date Jan 21, 2010
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20090321124
- Publication date Dec 31, 2009
- Yutaka KUMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090230546
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Shingo Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounting Method and Electronic Circuit Device
- Publication number 20090223705
- Publication date Sep 10, 2009
- Yoshihisa Yamashita
- B30 - PRESSES
Information Patent Application
Mounted Body and Method for Manufacturing the Same
- Publication number 20080251894
- Publication date Oct 16, 2008
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Solder Bump and Method for Mounting Semiconducto...
- Publication number 20080197173
- Publication date Aug 21, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...
- Publication number 20080128664
- Publication date Jun 5, 2008
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20060290009
- Publication date Dec 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module, process for producing the same, and film inte...
- Publication number 20060091524
- Publication date May 4, 2006
- Seiji Karashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20050269681
- Publication date Dec 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050263860
- Publication date Dec 1, 2005
- Matsushita Electric Industrial Co., Ltd.
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20050230848
- Publication date Oct 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate produced by transfer material method
- Publication number 20050186768
- Publication date Aug 25, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20040158980
- Publication date Aug 19, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit component built-in module with embedded semiconductor chip...
- Publication number 20040145044
- Publication date Jul 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040084769
- Publication date May 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit component built-in module and method of manufacturing the same
- Publication number 20030137045
- Publication date Jul 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transfer material method for producing the same and wiring substrat...
- Publication number 20030102153
- Publication date Jun 5, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20030090883
- Publication date May 15, 2003
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Insulation sheet and multi-layer wiring substrate and production pr...
- Publication number 20030085058
- Publication date May 8, 2003
- Shingo Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component built-in module and method of manufacturing the same
- Publication number 20030062624
- Publication date Apr 3, 2003
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component built-in module and method of manufacturing the same
- Publication number 20020135058
- Publication date Sep 26, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshiyuki Asahi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component built-in module and method for producing the same
- Publication number 20020117743
- Publication date Aug 29, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer material, method for producing the same and wiring substra...
- Publication number 20010023779
- Publication date Sep 27, 2001
- Yasuhiro Sugaya
- H01 - BASIC ELECTRIC ELEMENTS

Shingo Komatsu

Person

Patents Grantslast 30 patents

Field-effect transistor and method for manufacturing the same

Flip-chip mounting resin composition and bump forming resin composi...

Method for making a semiconductor device on a flexible substrate

Semiconductor device and manufacturing process thereof

Mounted body and method for manufacturing the same

Manufacturing method of flexible semiconductor device and flexible...

Electronic component mounting method

Mounted body and method for manufacturing the same

Transfer material used for producing a wiring substrate

Manufacturing method of flexible semiconductor device and flexible...

Mounted body and method for manufacturing the same

Method for forming solder bump and method for mounting semiconducto...

Semiconductor device and method for manufacturing the same

Component built-in module and method for producing the same

Component built-in module and method for producing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Circuit component built-in module with embedded semiconductor chip...

Component built-in module and method for producing the same

Method of manufacturing a component built-in module

Component built-in module and method for producing the same

Wiring substrate produced by transfer material method

Transfer material for wiring substrate

Insulation sheet, multi-layer wiring substrate and production proce...

Circuit component built-in module with embedded semiconductor chip...

Component built-in module and method for producing the same

Component built-in module and method of manufacturing the same

Patents Applicationslast 30 patents

FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE...

METHOD FOR FABRICATING FLEXIBLE SEMICONDUCTOR DEVICE AND LAYERED FI...

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE...

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

Electronic Component Mounting Method and Electronic Circuit Device

Mounted Body and Method for Manufacturing the Same

Method for Forming Solder Bump and Method for Mounting Semiconducto...

Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...

Semiconductor device and method for manufacturing the same

Semiconductor module, process for producing the same, and film inte...

Component built-in module and method for producing the same

Semiconductor device and method for manufacturing the same

Component built-in module and method for producing the same

Wiring substrate produced by transfer material method

Component built-in module and method for producing the same

Circuit component built-in module with embedded semiconductor chip...

Semiconductor device and method for manufacturing the same

Circuit component built-in module and method of manufacturing the same

Transfer material method for producing the same and wiring substrat...

Component built-in module and method for producing the same

Insulation sheet and multi-layer wiring substrate and production pr...

Component built-in module and method of manufacturing the same

Component built-in module and method of manufacturing the same

Component built-in module and method for producing the same

Transfer material, method for producing the same and wiring substra...