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Shinichi Ishiwata

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  • Hiratsuka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing tape
    • Patent number 9,324,593
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer processing tape
    • Patent number 9,324,592
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer-adhering adhesive tape
    • Patent number 8,722,184
    • Issue date May 13, 2014
    • The Furukawa Electric Co., Ltd.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer-processing tape and method of producing the same
    • Patent number 8,545,979
    • Issue date Oct 1, 2013
    • The Furukawa Electric Co., Ltd.
    • Kenji Kita
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Method of producing a semiconductor device, and wafer-processing tape
    • Patent number 8,043,698
    • Issue date Oct 25, 2011
    • The Furukawa Electric Co., Ltd.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Semiconductor wafer processing tape
    • Patent number D628170
    • Issue date Nov 30, 2010
    • The Furukawa Electric Company
    • Hiromitsu Maruyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor wafer processing tape
    • Patent number D621803
    • Issue date Aug 17, 2010
    • The Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Dicing/die bonding sheet
    • Patent number 7,517,724
    • Issue date Apr 14, 2009
    • Hitachi Chemical Company, Ltd.
    • Keiichi Hatakeyama
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Method of manufacturing a thin-film circuit substrate having penetr...
    • Patent number 7,413,965
    • Issue date Aug 19, 2008
    • The Furukawa Electric Co., Ltd.
    • Shinichi Ishiwata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor wafer-securing adhesive tape
    • Patent number 5,538,771
    • Issue date Jul 23, 1996
    • Furukawa Electric Co., Ltd.
    • Koji Nakayama
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Surface-protection method during etching
    • Patent number 5,300,172
    • Issue date Apr 5, 1994
    • The Furukawa Electric Co., Ltd.
    • Shinichi Ishiwata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Radiation-curable adhesive tape
    • Patent number 5,281,473
    • Issue date Jan 25, 1994
    • Furakawa Electric Co., Ltd.
    • Shinichi Ishiwata
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Radiation-curable adhesive tape
    • Patent number 5,149,586
    • Issue date Sep 22, 1992
    • Furukawa Electric Co., Ltd.
    • Shinichi Ishiwata
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Radiation-curable adhesive tape
    • Patent number 4,999,242
    • Issue date Mar 12, 1991
    • Furukawa Electric Co., Ltd.
    • Shinichi Ishiwata
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING TAPE
    • Publication number 20120100325
    • Publication date Apr 26, 2012
    • Hiromitsu MARUYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    ADHESIVE TAPE FOR ELECTRONIC COMPONENT FABRICATION
    • Publication number 20110014443
    • Publication date Jan 20, 2011
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Hirotoki Yokoi
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WAFER PROCESSING TAPE
    • Publication number 20100227165
    • Publication date Sep 9, 2010
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WAFER-ADHERING ADHESIVE TAPE
    • Publication number 20080299345
    • Publication date Dec 4, 2008
    • Yasumasa MORISHIMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Method of producing a semiconductor device, and wafer-processing tape
    • Publication number 20070141330
    • Publication date Jun 21, 2007
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Wafer-processing tape
    • Publication number 20060204749
    • Publication date Sep 14, 2006
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Kenji Kita
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Wafer-processing tape and method of producing the same
    • Publication number 20060154066
    • Publication date Jul 13, 2006
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Kenji Kita
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Method of manufacturing a thin-film circuit substrate having penetr...
    • Publication number 20060115989
    • Publication date Jun 1, 2006
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Shinichi Ishiwata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer-adhering adhesive tape
    • Publication number 20050249909
    • Publication date Nov 10, 2005
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...