Shinichi Kazui

Person

Hadano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser processing apparatus
- Patent number 6,677,553
- Issue date Jan 13, 2004
- Hitachi, Ltd.
- Takashi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,551,449
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and an apparatus for manufacturing multi-layer boards using...
- Patent number 6,498,319
- Issue date Dec 24, 2002
- Hitachi, Ltd.
- Takashi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface reformation method of high polymer material
- Patent number 6,423,405
- Issue date Jul 23, 2002
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,410,881
- Issue date Jun 25, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method, semiconductor device and method of manufacturing s...
- Patent number 6,406,357
- Issue date Jun 18, 2002
- Hitachi, Ltd.
- Shinichi Kazui
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,340,109
- Issue date Jan 22, 2002
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,269,998
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,203,655
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,196,441
- Issue date Mar 6, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,161,748
- Issue date Dec 19, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, IC card, and manufacturing method thereof
- Patent number 6,137,687
- Issue date Oct 24, 2000
- Hitachi, Ltd.
- Mitsugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,133,135
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring the height of an object
- Patent number 6,069,701
- Issue date May 30, 2000
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Laser assisted surface reformation method of high polymer material
- Patent number 6,017,424
- Issue date Jan 25, 2000
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser cleavage cutting method and system
- Patent number 5,968,382
- Issue date Oct 19, 1999
- Hitachi, Ltd.
- Takashi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 5,940,728
- Issue date Aug 17, 1999
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 5,906,309
- Issue date May 25, 1999
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Method of modifying conductive lines of an electronic circuit board...
- Patent number 5,832,595
- Issue date Nov 10, 1998
- Hitachi, Ltd.
- Shigenobu Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface reformation method of high polymer material
- Patent number 5,801,350
- Issue date Sep 1, 1998
- Hitachi, Ltd.
- Tsutomu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive bumps
- Patent number 5,551,148
- Issue date Sep 3, 1996
- Hitachi, Ltd.
- Shinichi Kazui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition apparatus and profile-following device suitable for appa...
- Patent number 5,520,733
- Issue date May 28, 1996
- Hitachi, Ltd.
- Hiroyuki Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making electronic device
- Patent number 5,499,668
- Issue date Mar 19, 1996
- Hitachi, Ltd.
- Kaoru Katayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drilling apparatus of hard brittle material and method thereof
- Patent number 5,498,109
- Issue date Mar 12, 1996
- Hitachi, Ltd.
- Toshihiro Mine
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Grinding method and grinding machine
- Patent number 5,390,446
- Issue date Feb 21, 1995
- Hitachi, Ltd.
- Shinichi Kazui
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-chip-module
- Patent number 5,150,274
- Issue date Sep 22, 1992
- Hitachi, Ltd.
- Kenichi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with a uniform conductive layer formed by equ...
- Patent number 5,023,407
- Issue date Jun 11, 1991
- Hitachi, Ltd.
- Mitugu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective working method
- Patent number 4,766,009
- Issue date Aug 23, 1988
- Hitachi, Ltd.
- Midori Imura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating process and process for producing multilayer wi...
- Patent number 4,659,587
- Issue date Apr 21, 1987
- Hitachi, Ltd.
- Midori Imura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Parts-connecting apparatus using solder
- Patent number 4,620,663
- Issue date Nov 4, 1986
- Hitachi, Ltd.
- Hitoshi Odashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Laser processing apparatus
- Publication number 20030052104
- Publication date Mar 20, 2003
- Takashi Matsumoto
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE REFORMATION METHOD OF HIGH POLYMER MATERIAL
- Publication number 20020048664
- Publication date Apr 25, 2002
- TSUTOMU SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin electronic circuit component and method and apparatus for prod...
- Publication number 20010050138
- Publication date Dec 13, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Process for manufacturing electronic circuits
- Publication number 20010039725
- Publication date Nov 15, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder bump measuring method and apparatus
- Publication number 20010000904
- Publication date May 10, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING

Shinichi Kazui

Person

Patents Grantslast 30 patents

Laser processing apparatus

Thin electronic circuit component and method and apparatus for prod...

Method and an apparatus for manufacturing multi-layer boards using...

Surface reformation method of high polymer material

Process for manufacturing electronic circuits

Grinding method, semiconductor device and method of manufacturing s...

Solder bump measuring method and apparatus

Process for manufacturing electronic circuits

Thin electronic circuit component and method and apparatus for prod...

Solder bump measuring method and apparatus

Process for manufacturing electronic circuits

Printed circuit board, IC card, and manufacturing method thereof

Process for manufacturing electronic circuits

Method and apparatus for measuring the height of an object

Laser assisted surface reformation method of high polymer material

Laser cleavage cutting method and system

Process for manufacturing electronic circuits

Solder bump measuring method and apparatus

Method of modifying conductive lines of an electronic circuit board...

Surface reformation method of high polymer material

Method for forming conductive bumps

Deposition apparatus and profile-following device suitable for appa...

Process for making electronic device

Drilling apparatus of hard brittle material and method thereof

Grinding method and grinding machine

Multi-chip-module

Printed circuit board with a uniform conductive layer formed by equ...

Selective working method

Electroless plating process and process for producing multilayer wi...

Parts-connecting apparatus using solder

Patents Applicationslast 30 patents

Laser processing apparatus

SURFACE REFORMATION METHOD OF HIGH POLYMER MATERIAL

Thin electronic circuit component and method and apparatus for prod...

Process for manufacturing electronic circuits

Solder bump measuring method and apparatus