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Shinichi Nishiura

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  • Fussa-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Ball forming device in a bonding apparatus and ball forming method
    • Patent number 7,658,313
    • Issue date Feb 9, 2010
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus, ball forming device in said bonding apparatus, a...
    • Patent number 7,644,852
    • Issue date Jan 12, 2010
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Initial ball forming method for wire bonding wire and wire bonding...
    • Patent number 7,299,966
    • Issue date Nov 27, 2007
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Initial ball forming method for wire bonding wire and wire bonding...
    • Patent number 6,874,673
    • Issue date Apr 5, 2005
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic horn for a bonding apparatus
    • Patent number 6,845,897
    • Issue date Jan 25, 2005
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ball formation method and ball forming device used in a wire bondin...
    • Patent number 6,784,394
    • Issue date Aug 31, 2004
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Transducer for a bonding apparatus
    • Patent number 6,758,383
    • Issue date Jul 6, 2004
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic horn for a bonding apparatus
    • Patent number 6,422,448
    • Issue date Jul 23, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,343,733
    • Issue date Feb 5, 2002
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,315,190
    • Issue date Nov 13, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 6,305,594
    • Issue date Oct 23, 2001
    • Kabushiki Kaisha Shinkawa
    • Toru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,270,000
    • Issue date Aug 7, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,250,539
    • Issue date Jun 26, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire loop shape for a semiconductor device
    • Patent number 6,222,274
    • Issue date Apr 24, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,213,384
    • Issue date Apr 10, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,182,885
    • Issue date Feb 6, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 6,164,518
    • Issue date Dec 26, 2000
    • Kabushiki Kaisha Shinkawa
    • Toru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,112,974
    • Issue date Sep 5, 2000
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device and wire bonding method therefor
    • Patent number 5,989,995
    • Issue date Nov 23, 1999
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,967,401
    • Issue date Oct 19, 1999
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,961,029
    • Issue date Oct 5, 1999
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents