Shinichi Nitta

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pipe welding structure
- Patent number 12,092,242
- Issue date Sep 17, 2024
- CKD Corporation
- Shinichi Nitta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid feed pump and flow control device
- Patent number 8,888,471
- Issue date Nov 18, 2014
- CKD Corporation
- Shinichi Nitta
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Multi-layer diaphragm
- Patent number 8,807,014
- Issue date Aug 19, 2014
- CKD Corporation
- Shinichi Nitta
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Patent number 7,700,381
- Issue date Apr 20, 2010
- Kabushikia Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element formation substrate, method of manufacturing the same, and...
- Patent number 7,510,945
- Issue date Mar 31, 2009
- Kabushiki Kaisha Toshiba
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using partial SOI substrate and manufacturing...
- Patent number 7,439,112
- Issue date Oct 21, 2008
- Kabushiki Kaisha Toshiba
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed in semiconductor layer arranged on subs...
- Patent number 7,420,249
- Issue date Sep 2, 2008
- Kabushiki Kaisha Toshiba
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element formation substrate for forming semiconductor device
- Patent number 7,285,825
- Issue date Oct 23, 2007
- Kabushiki Kaisha Toshiba
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip which combines bulk and SOI regions and separate...
- Patent number 7,148,543
- Issue date Dec 12, 2006
- Kabushiki Kaisha Toshiba
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using partial SOI substrate and manufacturing...
- Patent number 7,112,822
- Issue date Sep 26, 2006
- Kabushiki Kaisha Toshiba
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Patent number 7,057,259
- Issue date Jun 6, 2006
- Kabushiki Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed in semiconductor layer arranged on subs...
- Patent number 7,019,365
- Issue date Mar 28, 2006
- Kabushiki Kaisha Toshiba
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having multiple functional blocks integrated in...
- Patent number 7,018,904
- Issue date Mar 28, 2006
- Kabushiki Kaisha Toshiba
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having one of patterned SOI and SON structure
- Patent number 6,906,384
- Issue date Jun 14, 2005
- Kabushiki Kaisha Toshiba
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using partial SOI substrate and manufacturing...
- Patent number 6,855,976
- Issue date Feb 15, 2005
- Kabushiki Kaisha Toshiba
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip which combines bulk and SOI regions and separate...
- Patent number 6,835,981
- Issue date Dec 28, 2004
- Kabushiki Kaisha Toshiba
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed in semiconductor layer arranged on subs...
- Patent number 6,630,714
- Issue date Oct 7, 2003
- Kabushiki Kaisha Toshiba
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum pressure control system
- Patent number 6,202,681
- Issue date Mar 20, 2001
- CDK Corporation
- Masayuki Kouketsu
- G05 - CONTROLLING REGULATING
Information Patent Grant
Vacuum pressure control system
- Patent number 6,041,814
- Issue date Mar 28, 2000
- CKD Corporation
- Masayuki Kouketsu
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
FLOW RATE MEASUREMENT UNIT, FLOW RATE MEASUREMENT SYSTEM, AND FLOW...
- Publication number 20240353247
- Publication date Oct 24, 2024
- CKD CORPORATION
- Shinichi Nitta
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE CONTROL SYSTEM
- Publication number 20240151444
- Publication date May 9, 2024
- CKD CORPORATION
- Norio Kokubo
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
TEMPERATURE REGULATING APPARATUS FOR SEMICONDUCTOR-DEVICE MANUFACTU...
- Publication number 20230317482
- Publication date Oct 5, 2023
- EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD.
- Yukihiro FUKUSUMI
- G05 - CONTROLLING REGULATING
Information Patent Application
PIPE WELDING STRUCTURE
- Publication number 20220316629
- Publication date Oct 6, 2022
- CKD CORPORATION
- Shinichi Nitta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROMIXER
- Publication number 20220314177
- Publication date Oct 6, 2022
- CKD CORPORATION
- Shinichi Nitta
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
HEAT EXCHANGE SYSTEM
- Publication number 20220187027
- Publication date Jun 16, 2022
- CKD CORPORATION
- Akihiro ITO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LEVER TYPE SWITCHING VALVE
- Publication number 20150021505
- Publication date Jan 22, 2015
- CKD CORPORATION
- Shinichi NITTA
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
MULTI-LAYER DIAPHRAGM
- Publication number 20140030480
- Publication date Jan 30, 2014
- CKD CORPORATION
- Shinichi NITTA
- B32 - LAYERED PRODUCTS
Information Patent Application
LIQUID FEED PUMP AND FLOW CONTROL DEVICE
- Publication number 20130343909
- Publication date Dec 26, 2013
- CKD CORPORATION
- Shinichi NITTA
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
CAMERA MODULE FABRICATING METHOD AND CAMERA MODULE
- Publication number 20110019077
- Publication date Jan 27, 2011
- Kabushiki Kaisha Toshiba
- Masaru Kobayashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Element formation substrate, method of manufacturing the same, and...
- Publication number 20080044983
- Publication date Feb 21, 2008
- Kabushiki Kaisha Toshiba
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FORMED IN SEMICONDUCTOR LAYER ARRANGED ON SUBS...
- Publication number 20080012078
- Publication date Jan 17, 2008
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using partial SOI substrate and manufacturing...
- Publication number 20060273330
- Publication date Dec 7, 2006
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Publication number 20060131696
- Publication date Jun 22, 2006
- Kabushiki Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device formed in semiconductor layer arranged on subs...
- Publication number 20050156245
- Publication date Jul 21, 2005
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using partial SOI substrate and manufacturing...
- Publication number 20050093066
- Publication date May 5, 2005
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having multiple functional blocks integrated in...
- Publication number 20050019999
- Publication date Jan 27, 2005
- KABUSHIKI KAISHA TOSHIBA
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip which combines bulk and SOI regions and separate...
- Publication number 20040195626
- Publication date Oct 7, 2004
- KABUSHIKI KAISHA TOSHIBA
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Element formation substrate, method of manufacturing the same, and...
- Publication number 20040150044
- Publication date Aug 5, 2004
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device formed in semiconductor layer arranged on subs...
- Publication number 20040026739
- Publication date Feb 12, 2004
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having one of patterned SOI and SON structure
- Publication number 20030201512
- Publication date Oct 30, 2003
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having one of patterned SOI and SON structure
- Publication number 20030151112
- Publication date Aug 14, 2003
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using partial SOI substrate and manufacturing...
- Publication number 20030122124
- Publication date Jul 3, 2003
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device formed in semiconductor layer arranged on subs...
- Publication number 20030122191
- Publication date Jul 3, 2003
- Hajime Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip having multiple functional blocks integrated in...
- Publication number 20030057487
- Publication date Mar 27, 2003
- Kabushiki Kaisha Toshiba
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Publication number 20030003608
- Publication date Jan 2, 2003
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS

Shinichi Nitta

Person

Patents Grantslast 30 patents

Pipe welding structure

Liquid feed pump and flow control device

Multi-layer diaphragm

Semiconductor wafer with ID mark, equipment for and method of manuf...

Element formation substrate, method of manufacturing the same, and...

Semiconductor device using partial SOI substrate and manufacturing...

Semiconductor device formed in semiconductor layer arranged on subs...

Element formation substrate for forming semiconductor device

Semiconductor chip which combines bulk and SOI regions and separate...

Semiconductor device using partial SOI substrate and manufacturing...

Semiconductor wafer with ID mark, equipment for and method of manuf...

Semiconductor device formed in semiconductor layer arranged on subs...

Semiconductor chip having multiple functional blocks integrated in...

Semiconductor device having one of patterned SOI and SON structure

Semiconductor device using partial SOI substrate and manufacturing...

Semiconductor chip which combines bulk and SOI regions and separate...

Semiconductor device formed in semiconductor layer arranged on subs...

Vacuum pressure control system

Vacuum pressure control system

Patents Applicationslast 30 patents

FLOW RATE MEASUREMENT UNIT, FLOW RATE MEASUREMENT SYSTEM, AND FLOW...

TEMPERATURE CONTROL SYSTEM

TEMPERATURE REGULATING APPARATUS FOR SEMICONDUCTOR-DEVICE MANUFACTU...

PIPE WELDING STRUCTURE

MICROMIXER

HEAT EXCHANGE SYSTEM

LEVER TYPE SWITCHING VALVE

MULTI-LAYER DIAPHRAGM

LIQUID FEED PUMP AND FLOW CONTROL DEVICE

CAMERA MODULE FABRICATING METHOD AND CAMERA MODULE

Element formation substrate, method of manufacturing the same, and...

SEMICONDUCTOR DEVICE FORMED IN SEMICONDUCTOR LAYER ARRANGED ON SUBS...

Semiconductor device using partial SOI substrate and manufacturing...

Semiconductor wafer with ID mark, equipment for and method of manuf...

Semiconductor device formed in semiconductor layer arranged on subs...

Semiconductor device using partial SOI substrate and manufacturing...

Semiconductor chip having multiple functional blocks integrated in...

Semiconductor chip which combines bulk and SOI regions and separate...

Element formation substrate, method of manufacturing the same, and...

Semiconductor device formed in semiconductor layer arranged on subs...

Semiconductor device having one of patterned SOI and SON structure

Semiconductor device having one of patterned SOI and SON structure

Semiconductor device using partial SOI substrate and manufacturing...

Semiconductor device formed in semiconductor layer arranged on subs...

Semiconductor chip having multiple functional blocks integrated in...

Semiconductor wafer with ID mark, equipment for and method of manuf...