Shinichiro Yagi

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 10,460,983
- Issue date Oct 29, 2019
- SHIN-ETSU HANDOTAI CO.,LTD.
- Taishi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer and SOI wafer
- Patent number 7,892,948
- Issue date Feb 22, 2011
- Shin-Etsu Handotai Co., Ltd.
- Shinichiro Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection device for crystal defect of silicon wafer and method fo...
- Patent number 6,753,955
- Issue date Jun 22, 2004
- Shin-Etsu Handotai Co., Ltd.
- Shinichiro Yagi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20170040210
- Publication date Feb 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taishi WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Soi Wafer and Soi Wafer
- Publication number 20090042364
- Publication date Feb 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Shinichiro Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vapor phase growth apparatus and method of fabricating epitaxial wafer
- Publication number 20070122323
- Publication date May 31, 2007
- Shin-Etsu Handotai Co., Ltd.
- Toru Yamada
- C30 - CRYSTAL GROWTH
Information Patent Application
Inspection device for crystal defect of silicon wafer and method fo...
- Publication number 20020167661
- Publication date Nov 14, 2002
- Shinichiro Yagi
- C30 - CRYSTAL GROWTH