Shinji AKAIKE

Follow

Person

Nirasaki-City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Probe apparatus and probe method
- Patent number 10,310,010
- Issue date Jun 4, 2019
- Tokyo Electron Limited
- Muneaki Tamura
- G01 - MEASURING TESTING
Information Patent Grant
Substrate inspection apparatus and control method thereof
- Patent number 10,074,192
- Issue date Sep 11, 2018
- Tokyo Electron Limited
- Kenta Saiki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Position accuracy inspecting method, position accuracy inspecting a...
- Patent number 10,006,941
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Kenta Saiki
- G01 - MEASURING TESTING
Information Patent Grant
Probe method and apparatus with improved probe contact
- Patent number 5,777,485
- Issue date Jul 7, 1998
- Tokyo Electron Limited
- Hideaki Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Probe system and probe method
- Patent number 5,640,101
- Issue date Jun 17, 1997
- Tokyo Electron Limited
- Motohiro Kuji
- G01 - MEASURING TESTING
Information Patent Grant
Probe system having vertical height detection and double focal imag...
- Patent number 5,585,738
- Issue date Dec 17, 1996
- Tokyo Electron Limited
- Motohiro Kuji
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
POSITION ACCURACY INSPECTING METHOD, POSITION ACCURACY INSPECTING A...
- Publication number 20170219625
- Publication date Aug 3, 2017
- TOKYO ELECTRON LIMITED
- Kenta Saiki
- G01 - MEASURING TESTING
Information Patent Application
PROBE APPARATUS AND PROBE METHOD
- Publication number 20160161553
- Publication date Jun 9, 2016
- TOKYO ELECTRON LIMITED
- Muneaki TAMURA
- G01 - MEASURING TESTING
Information Patent Application
Substrate Inspection Apparatus and Control Method Thereof
- Publication number 20160098837
- Publication date Apr 7, 2016
- TOKYO ELECTRON LIMITED
- Kenta SAIKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20160001543
- Publication date Jan 7, 2016
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20150017782
- Publication date Jan 15, 2015
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS