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Shinji Hayashi
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Fujisawa, JP
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last 30 patents
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Patent Grant
Electroless copper plating solution and method for electroless copp...
Patent number
6,193,789
Issue date
Feb 27, 2001
Ebara-Udylite Co., Ltd.
Hideo Honma
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...