Shinji Miyazawa

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 12,068,346
- Issue date Aug 20, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus, manufacturing method of the same, an...
- Patent number 11,991,468
- Issue date May 21, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
- Patent number 11,973,091
- Issue date Apr 30, 2024
- Sony Corporation
- Harumi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,600,648
- Issue date Mar 7, 2023
- Sony Group Corporation
- Takaaki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 11,594,563
- Issue date Feb 28, 2023
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 11,581,346
- Issue date Feb 14, 2023
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 11,508,773
- Issue date Nov 22, 2022
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus, manufacturing method of the same, an...
- Patent number 11,438,540
- Issue date Sep 6, 2022
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,037,975
- Issue date Jun 15, 2021
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor including grooves
- Patent number 11,024,658
- Issue date Jun 1, 2021
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
- Patent number 10,923,517
- Issue date Feb 16, 2021
- Sony Corporation
- Harumi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 10,777,598
- Issue date Sep 15, 2020
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 10,756,130
- Issue date Aug 25, 2020
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device, manufacturing method, and electronic apparatus
- Patent number 10,748,947
- Issue date Aug 18, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
- Patent number 10,672,809
- Issue date Jun 2, 2020
- Sony Corporation
- Harumi Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 10,608,028
- Issue date Mar 31, 2020
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and electronic apparatus including a package having a micro...
- Patent number 10,332,924
- Issue date Jun 25, 2019
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging apparatus having multiple structures to reduce...
- Patent number 10,321,079
- Issue date Jun 11, 2019
- Sony Corporation
- Shinji Miyazawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image pickup element, image pickup apparatus, electroni...
- Patent number 10,236,315
- Issue date Mar 19, 2019
- Sony Corporation
- Yutaka Ooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensor having improved dicing properties
- Patent number 10,038,021
- Issue date Jul 31, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 10,032,816
- Issue date Jul 24, 2018
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties, manufacturing appar...
- Patent number 9,991,301
- Issue date Jun 5, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including an organic...
- Patent number 9,941,318
- Issue date Apr 10, 2018
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 9,929,197
- Issue date Mar 27, 2018
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 9,812,479
- Issue date Nov 7, 2017
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 9,728,568
- Issue date Aug 8, 2017
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image sensor and electronic device
- Patent number 9,257,474
- Issue date Feb 9, 2016
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method of manufacturing the same, and e...
- Patent number 9,059,062
- Issue date Jun 16, 2015
- Sony Corporation
- Yuhi Yorikado
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging apparatus, camera, and method of manufacturing...
- Patent number 8,593,554
- Issue date Nov 26, 2013
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20240371896
- Publication date Nov 7, 2024
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240363663
- Publication date Oct 31, 2024
- Sony Semiconductor Solutions Corporation
- SHINGO TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS HAVING OUTPUT CIRCUIT UNIT FOR OUTPUT...
- Publication number 20240290801
- Publication date Aug 29, 2024
- SONY GROUP CORPORATION
- Harumi TANAKA
- G01 - MEASURING TESTING
Information Patent Application
IMAGING DEVICE, ELECTRONIC APPARATUS
- Publication number 20240276114
- Publication date Aug 15, 2024
- Sony Semiconductor Solutions Corporation
- Tetsuya UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230178575
- Publication date Jun 8, 2023
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20230134510
- Publication date May 4, 2023
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230055685
- Publication date Feb 23, 2023
- SONY GROUP CORPORATION
- Shinji MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...
- Publication number 20220345653
- Publication date Oct 27, 2022
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20210305300
- Publication date Sep 30, 2021
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210265407
- Publication date Aug 26, 2021
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING APPARATUS HAVING OUTPUT CIRCUIT UNIT FOR OUTPUT...
- Publication number 20210134861
- Publication date May 6, 2021
- SONY CORPORATION
- Harumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200357839
- Publication date Nov 12, 2020
- SONY CORPORATION
- Shinji MIYAZAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20200279883
- Publication date Sep 3, 2020
- SONY CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20200273897
- Publication date Aug 27, 2020
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS
- Publication number 20200251511
- Publication date Aug 6, 2020
- SONY CORPORATION
- Harumi TANAKA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190244996
- Publication date Aug 8, 2019
- SONY CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...
- Publication number 20190238777
- Publication date Aug 1, 2019
- SONY CORPORATION
- Shinji MIYAZAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
- Publication number 20190172863
- Publication date Jun 6, 2019
- Sony Semiconductor Solutions Corporation
- Yoshiaki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS
- Publication number 20190103426
- Publication date Apr 4, 2019
- SONY CORPORATION
- Harumi TANAKA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190043910
- Publication date Feb 7, 2019
- SONY CORPORATION
- Shinji MIYAZAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20180331142
- Publication date Nov 15, 2018
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20180197908
- Publication date Jul 12, 2018
- SONY CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180190700
- Publication date Jul 5, 2018
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...
- Publication number 20180152657
- Publication date May 31, 2018
- SONY CORPORATION
- Shinji MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20170365633
- Publication date Dec 21, 2017
- SONY CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20170287964
- Publication date Oct 5, 2017
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170271389
- Publication date Sep 21, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20170234992
- Publication date Aug 17, 2017
- Sony Semiconductor Solutions Corporation
- Shinji Miyazawa
- G01 - MEASURING TESTING
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170236860
- Publication date Aug 17, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR, MANUFACTURING METHOD, AND RADIATION IMAGI...
- Publication number 20170234995
- Publication date Aug 17, 2017
- Sony Semiconductor Solutions Corporation
- Takeshi YANAGITA
- G01 - MEASURING TESTING

Shinji Miyazawa

Person

Patents Grantslast 30 patents

Image pickup device and electronic apparatus

Solid-state image sensor and electronic device

Solid-state imaging apparatus, manufacturing method of the same, an...

Solid-state imaging apparatus having output circuit unit for output...

Apparatuses and packages including a semiconductor substrate with a...

Image sensor having improved dicing properties

Solid-state image sensor and electronic device

Image pickup device and electronic apparatus

Solid-state imaging apparatus, manufacturing method of the same, an...

Apparatuses and packages including a semiconductor substrate with a...

Image sensor including grooves

Solid-state imaging apparatus having output circuit unit for output...

Image pickup device and electronic apparatus

Solid-state image sensor and electronic device

Imaging device, manufacturing method, and electronic apparatus

Solid-state imaging apparatus having output circuit unit for output...

Image sensor having improved dicing properties

Package and electronic apparatus including a package having a micro...

Solid-state imaging apparatus having multiple structures to reduce...

Solid-state image pickup element, image pickup apparatus, electroni...

Packaged image sensor having improved dicing properties

Solid-state image sensor and electronic device

Image sensor having improved dicing properties, manufacturing appar...

Semiconductor device and electronic apparatus including an organic...

Solid-state image sensor and electronic device

Solid-state image sensor and electronic device

Semiconductor device and electronic apparatus

Solid-state image sensor and electronic device

Solid-state imaging device, method of manufacturing the same, and e...

Solid-state imaging apparatus, camera, and method of manufacturing...

Patents Applicationslast 30 patents

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SENSOR DEVICE AND MANUFACTURING METHOD

SOLID-STATE IMAGING APPARATUS HAVING OUTPUT CIRCUIT UNIT FOR OUTPUT...

IMAGING DEVICE, ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING APPARATUS HAVING OUTPUT CIRCUIT UNIT FOR OUTPUT...

IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SOLID-STATE IMAGING APPARATUS

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...

IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING APPARATUS

IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SOLID-STATE IMAGE SENSOR, MANUFACTURING METHOD, AND RADIATION IMAGI...