Shinji Moriyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid integrated circuit device and electronic device
- Patent number 8,581,395
- Issue date Nov 12, 2013
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device and electronic device
- Patent number 8,222,734
- Issue date Jul 17, 2012
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 8,084,852
- Issue date Dec 27, 2011
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF power module
- Patent number 7,962,105
- Issue date Jun 14, 2011
- Renesas Electronics Corporation
- Yusuke Sato
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,902,656
- Issue date Mar 8, 2011
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,755,182
- Issue date Jul 13, 2010
- Renesas Technology Corp.
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF power module
- Patent number 7,706,756
- Issue date Apr 27, 2010
- Renesas Technology Corp.
- Yusuke Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,518,228
- Issue date Apr 14, 2009
- Renesas Technology Corp.
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,323,770
- Issue date Jan 29, 2008
- Renesas Technology Corp.
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency power amplifier system and wireless communication sy...
- Patent number 6,329,879
- Issue date Dec 11, 2001
- Hitachi, Ltd.
- Masashi Maruyama
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20120248630
- Publication date Oct 4, 2012
- RENESAS ELECTRONICS CORPORATION
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20120106110
- Publication date May 3, 2012
- RENESAS ELECTRONICS CORPORATION
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20110121365
- Publication date May 26, 2011
- RENESAS ELECTRONICS CORPORATION
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20100207275
- Publication date Aug 19, 2010
- Renesas Technology Corp.
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RF POWER MODULE
- Publication number 20100178879
- Publication date Jul 15, 2010
- Renesas Technology Corp.
- Yusuke Sato
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20090174060
- Publication date Jul 9, 2009
- Renesas Technology Corp.
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Hybrid integrated circuit device, and method for fabricating the sa...
- Publication number 20070252264
- Publication date Nov 1, 2007
- Shinji Moriyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RF POWER MODULE
- Publication number 20070210866
- Publication date Sep 13, 2007
- Yusuke Sato
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Hybrid integrated circuit device, and method for fabricating the sa...
- Publication number 20060091526
- Publication date May 4, 2006
- Shinji Moriyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Hybrid integrated circuit device and method for fabricating the sam...
- Publication number 20040080044
- Publication date Apr 29, 2004
- Shinji Moriyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Multilayer wiring board and semiconductor device
- Publication number 20020171138
- Publication date Nov 21, 2002
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency power amplifier system and wireless communication sy...
- Publication number 20020024392
- Publication date Feb 28, 2002
- Hitachi, Ltd.
- Masashi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS

Shinji Moriyama

Person

Patents Grantslast 30 patents

Hybrid integrated circuit device and electronic device

Hybrid integrated circuit device and electronic device

Hybrid integrated circuit device, and method for fabricating the sa...

RF power module

Hybrid integrated circuit device, and method for fabricating the sa...

Hybrid integrated circuit device, and method for fabricating the sa...

RF power module

Hybrid integrated circuit device, and method for fabricating the sa...

Hybrid integrated circuit device, and method for fabricating the sa...

High frequency power amplifier system and wireless communication sy...

Patents Applicationslast 30 patents

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

RF POWER MODULE

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

Hybrid integrated circuit device, and method for fabricating the sa...

RF POWER MODULE

Hybrid integrated circuit device, and method for fabricating the sa...

Hybrid integrated circuit device and method for fabricating the sam...

Multilayer wiring board and semiconductor device

High frequency power amplifier system and wireless communication sy...