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Shinji Okawa
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing direct bonded SOI wafer and direct bonded...
Patent number
7,855,129
Issue date
Dec 21, 2010
Sumco Corporation
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for regeneration of a layer transferred wafer and regenerat...
Patent number
7,829,436
Issue date
Nov 9, 2010
Sumco Corporation
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Grant
Method for manufacturing direct bonded SOI wafer and direct bonded...
Patent number
7,781,309
Issue date
Aug 24, 2010
Sumco Corporation
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD FOR MANUFACTURING DIRECT BONDED SOI WAFER AND DIRECT BONDED...
Publication number
20100219500
Publication date
Sep 2, 2010
SUMCO CORPORATION
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Manufacturing Direct Bonded SOI Wafer and Direct Bonded...
Publication number
20070148912
Publication date
Jun 28, 2007
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for Regeneration of a Layer Transferred Wafer and Regenerat...
Publication number
20070148914
Publication date
Jun 28, 2007
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Application
Process for Regeneration of a Layer Transferred Wafer and Regenerat...
Publication number
20070148917
Publication date
Jun 28, 2007
SUMCO CORPORATION
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS