Shinji Takei

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin-sealed semiconductor device
- Patent number 5,706,175
- Issue date Jan 6, 1998
- Kabushiki Kaisha Toshiba
- Shinji Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for encapsulating a semiconductor device and lead frame
- Patent number 5,665,651
- Issue date Sep 9, 1997
- Kabushiki Kaisha Toshiba
- Junichi Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, lead frame and method for manufacturing semic...
- Patent number 5,493,151
- Issue date Feb 20, 1996
- Kabushiki Kaisha Toshiba
- Junichi Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-sealed IC device of heat-resistant construction
- Patent number 4,866,506
- Issue date Sep 12, 1989
- Oki Electric Industry Co., Ltd.
- Seigo Nambu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-resistant plastic semiconductor device
- Patent number 4,777,520
- Issue date Oct 11, 1988
- Oki Electric Industry Co. Ltd.
- Seigo Nambu
- H01 - BASIC ELECTRIC ELEMENTS