Shinsuke Tei

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and semiconductor device
- Patent number 8,815,732
- Issue date Aug 26, 2014
- Shinkawa Ltd.
- Tatsunari Mii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 8,196,803
- Issue date Jun 12, 2012
- Shinkawa Ltd.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,191,759
- Issue date Jun 5, 2012
- Shinkawa Ltd.
- Shinsuke Tei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 8,123,108
- Issue date Feb 28, 2012
- Shinkawa Ltd.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20220328450
- Publication date Oct 13, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...
- Publication number 20200203307
- Publication date Jun 25, 2020
- SHINKAWA LTD.
- Shinsuke TEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120139129
- Publication date Jun 7, 2012
- SHINKAWA LTD.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20120055976
- Publication date Mar 8, 2012
- SHINKAWA LTD.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20110278349
- Publication date Nov 17, 2011
- SHINKAWA LTD.
- Shinsuke Tei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20110180590
- Publication date Jul 28, 2011
- SHINKAWA LTD.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Shinsuke Tei

Person

Patents Grantslast 30 patents

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Wire bonding apparatus and manufacturing method for semiconductor a...

Wire bonding method and semiconductor device

Method of manufacturing semiconductor device and wire bonding appar...

Wire bonding apparatus and wire bonding method

Method of manufacturing semiconductor device and wire bonding appar...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...