Shintaro Asuke

Person

Nagano-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding method and bonded body
- Patent number 8,679,283
- Issue date Mar 25, 2014
- Seiko Epson Corporation
- Takatoshi Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding method and bonded body
- Patent number 8,617,340
- Issue date Dec 31, 2013
- Seiko Epson Corporation
- Takatoshi Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a part of a MEMS system
- Patent number 8,486,218
- Issue date Jul 16, 2013
- Seiko Epson Corporation
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing liquid crystal device
- Patent number 8,243,249
- Issue date Aug 14, 2012
- Seiko Epson Corporation
- Shintaro Asuke
- G02 - OPTICS
Information Patent Grant
Separating method of bonded body
- Patent number 8,211,259
- Issue date Jul 3, 2012
- Seiko Epson Corporation
- Mitsuru Sato
- B08 - CLEANING
Information Patent Grant
Method of manufacturing bonded body and bonded body
- Patent number 8,101,044
- Issue date Jan 24, 2012
- Seiko Epson Corporation
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Coating method, liquid supplying head and liquid supplying apparatus
- Patent number 7,641,943
- Issue date Jan 5, 2010
- Seiko Epson Corporation
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Nozzle plate producing method
- Patent number 7,516,549
- Issue date Apr 14, 2009
- Seiko Epson Corporation
- Shintaro Asuke
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solvent removal apparatus and method
- Patent number 7,353,623
- Issue date Apr 8, 2008
- Seiko Epson Corporation
- Shintaro Asuke
- F26 - DRYING
Information Patent Grant
Method and system for evaluating lyophobicity of inner wall of fine...
- Patent number 7,305,868
- Issue date Dec 11, 2007
- Seiko Epson Corporation
- Shintaro Asuke
- G01 - MEASURING TESTING
Information Patent Grant
Liquid-repellent film-coated member, constitutive member of liquid-...
- Patent number 7,267,426
- Issue date Sep 11, 2007
- Seiko Epson Corporation
- Hiroo Miyajima
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Mask forming and removing method, and semiconductor device, an elec...
- Patent number 7,148,148
- Issue date Dec 12, 2006
- Seiko Epson Corporation
- Yoshiaki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a film of predetermined pattern on a surface as w...
- Patent number 7,098,121
- Issue date Aug 29, 2006
- Seiko Epson Corporation
- Yoshiaki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing system with reduc...
- Patent number 6,899,787
- Issue date May 31, 2005
- Alps Electric Co., Ltd.
- Akira Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for atmospheric pressure plasma surface treatm...
- Patent number 6,342,275
- Issue date Jan 29, 2002
- Seiko Epson Corporation
- Takuya Miyakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing a Part of a MEMS System
- Publication number 20130001810
- Publication date Jan 3, 2013
- SEIKO EPSON CORPORATION
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Bonding Method and Bonded Body
- Publication number 20120315450
- Publication date Dec 13, 2012
- SEIKO EPSON CORPORATION
- Takatoshi Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of Manufacturing a Part of a MEMS System
- Publication number 20120094132
- Publication date Apr 19, 2012
- SEIKO EPSON CORPORATION
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING LIQUID CRYSTAL DEVICE
- Publication number 20100006538
- Publication date Jan 14, 2010
- SEIKO EPSON CORPORATION
- Shintaro ASUKE
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY AND BONDED BODY
- Publication number 20090226741
- Publication date Sep 10, 2009
- SEIKO EPSON CORPORATION
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
BONDING METHOD AND BONDED BODY
- Publication number 20090136767
- Publication date May 28, 2009
- SEIKO EPSON CORPORATION
- Takatoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEPARATING METHOD OF BONDED BODY
- Publication number 20090133820
- Publication date May 28, 2009
- SEIKO EPSON CORPORATION
- Mitsuru SATO
- B08 - CLEANING
Information Patent Application
Nozzle plate producing method, nozzle plate, liquid droplet ejectin...
- Publication number 20060152549
- Publication date Jul 13, 2006
- Seiko Epson Corporation
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Coating method, liquid supplying head and liquid supplying apparatus
- Publication number 20060141167
- Publication date Jun 29, 2006
- Seiko Epson Corporation
- Shintaro Asuke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Solvent removal apparatus and method
- Publication number 20060137213
- Publication date Jun 29, 2006
- Seiko Epson Corporation
- Shintaro Asuke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for evaluating lyophobicity of inner wall of fine...
- Publication number 20050214948
- Publication date Sep 29, 2005
- Shintaro Asuke
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Liquid-repellent film-coated member, constitutive member of liquid-...
- Publication number 20050001879
- Publication date Jan 6, 2005
- Seiko Epson Corporation
- Hiroo Miyajima
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Continuous-treatment apparatus and continuous-treatment method
- Publication number 20040221616
- Publication date Nov 11, 2004
- Shintaro Asuke
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Pattern forming method and apparatus used for semiconductor device,...
- Publication number 20040209190
- Publication date Oct 21, 2004
- Yoshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film formation method as well as device manufactured by employing t...
- Publication number 20040082163
- Publication date Apr 29, 2004
- SEIKO EPSON CORPORATION
- Yoshiaki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask forming and removing method, and a semiconductor device, an el...
- Publication number 20030143845
- Publication date Jul 31, 2003
- SEIKO EPSON CORPORATION
- Yoshiaki Mori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plasma processing apparatus and plasma processing system with reduc...
- Publication number 20030056901
- Publication date Mar 27, 2003
- Alps Electric Co., Ltd.
- Akira Nakano
- H01 - BASIC ELECTRIC ELEMENTS

Shintaro Asuke

Person

Patents Grantslast 30 patents

Bonding method and bonded body

Bonding method and bonded body

Method of manufacturing a part of a MEMS system

Method of manufacturing liquid crystal device

Separating method of bonded body

Method of manufacturing bonded body and bonded body

Coating method, liquid supplying head and liquid supplying apparatus

Nozzle plate producing method

Solvent removal apparatus and method

Method and system for evaluating lyophobicity of inner wall of fine...

Liquid-repellent film-coated member, constitutive member of liquid-...

Mask forming and removing method, and semiconductor device, an elec...

Method of forming a film of predetermined pattern on a surface as w...

Plasma processing apparatus and plasma processing system with reduc...

Method and apparatus for atmospheric pressure plasma surface treatm...

Patents Applicationslast 30 patents

Method of Manufacturing a Part of a MEMS System

Bonding Method and Bonded Body

Method of Manufacturing a Part of a MEMS System

METHOD OF MANUFACTURING LIQUID CRYSTAL DEVICE

METHOD OF MANUFACTURING BONDED BODY AND BONDED BODY

BONDING METHOD AND BONDED BODY

SEPARATING METHOD OF BONDED BODY

Nozzle plate producing method, nozzle plate, liquid droplet ejectin...

Coating method, liquid supplying head and liquid supplying apparatus

Solvent removal apparatus and method

Method and system for evaluating lyophobicity of inner wall of fine...

Liquid-repellent film-coated member, constitutive member of liquid-...

Continuous-treatment apparatus and continuous-treatment method

Pattern forming method and apparatus used for semiconductor device,...

Film formation method as well as device manufactured by employing t...

Mask forming and removing method, and a semiconductor device, an el...

Plasma processing apparatus and plasma processing system with reduc...