Shintaro Yamamichi

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 10,098,179
- Issue date Oct 9, 2018
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device
- Patent number 9,362,263
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,362,262
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of magnetic shields
- Patent number 9,324,663
- Issue date Apr 26, 2016
- Renesas Electronics Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,172,028
- Issue date Oct 27, 2015
- Renesas Electronics Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,165,879
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,117,814
- Issue date Aug 25, 2015
- Renesas Electronics Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,975,150
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Functional element built-in substrate and wiring substrate
- Patent number 8,929,090
- Issue date Jan 6, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,872,334
- Issue date Oct 28, 2014
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a metal-insulator-metal (MIM) capacitor havi...
- Patent number 8,815,678
- Issue date Aug 26, 2014
- Renesas Electronics Corporation
- Toshihiro Iizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor element-embedded substrate, and method of manufacturi...
- Patent number 8,810,008
- Issue date Aug 19, 2014
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in semiconductor element
- Patent number 8,766,440
- Issue date Jul 1, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,749,033
- Issue date Jun 10, 2014
- Renesas Electronics Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element-embedded wiring substrate
- Patent number 8,710,639
- Issue date Apr 29, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacture in which minimum wiring pitch of c...
- Patent number 8,710,669
- Issue date Apr 29, 2014
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board capable of containing functional element and method fo...
- Patent number 8,692,135
- Issue date Apr 8, 2014
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,692,364
- Issue date Apr 8, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,569,892
- Issue date Oct 29, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 8,552,570
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,536,691
- Issue date Sep 17, 2013
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,344,498
- Issue date Jan 1, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,304,915
- Issue date Nov 6, 2012
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a thin film capacitor of a MIM (metal-i...
- Patent number 8,212,299
- Issue date Jul 3, 2012
- Renesas Electronics Corporation
- Toshihiro Iizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-insulator-metal (MIM) capacitor having capacitor dielectric m...
- Patent number 8,169,013
- Issue date May 1, 2012
- Renesas Electronics Corporation
- Toshihiro Iizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,072,073
- Issue date Dec 6, 2011
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing the...
- Patent number 8,050,050
- Issue date Nov 1, 2011
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an LSI chip and a method for manufac...
- Patent number 8,043,953
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150333048
- Publication date Nov 19, 2015
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150171066
- Publication date Jun 18, 2015
- Renesas Electronics Corporation
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE
- Publication number 20150053474
- Publication date Feb 26, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140367863
- Publication date Dec 18, 2014
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361411
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361410
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140329476
- Publication date Nov 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A METAL-INSULATOR-METAL (MIM) CAPACITOR HAVI...
- Publication number 20140327064
- Publication date Nov 6, 2014
- Toshihiro IIZUKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140239425
- Publication date Aug 28, 2014
- RENESAS ELECTRONICS CORPORATION
- TAKAHITO WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140024177
- Publication date Jan 23, 2014
- NEC Corporation
- KENTARO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE
- Publication number 20130127037
- Publication date May 23, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIMEDIA PROVIDING SERVICE
- Publication number 20130087927
- Publication date Apr 11, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT
- Publication number 20130088841
- Publication date Apr 11, 2013
- NEC Corporation
- Daisuke Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE
- Publication number 20130050967
- Publication date Feb 28, 2013
- NEC Corporation
- Daisuke Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130026653
- Publication date Jan 31, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20130026632
- Publication date Jan 31, 2013
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...
- Publication number 20130009325
- Publication date Jan 10, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT
- Publication number 20120319254
- Publication date Dec 20, 2012
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE
- Publication number 20120300425
- Publication date Nov 29, 2012
- NEC Corporation
- Yoshiki Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THIN FILM CAPACITOR AND METHOD FOR FA...
- Publication number 20120261735
- Publication date Oct 18, 2012
- RENESAS ELECTRONICS CORPORATION
- Toshihiro IIZUKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120153501
- Publication date Jun 21, 2012
- Renesas Electronics Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120133052
- Publication date May 31, 2012
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device And Method Of Manufacturing Semiconductor Device
- Publication number 20120119338
- Publication date May 17, 2012
- RENESAS ELECTRONICS CORPORATION
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120068359
- Publication date Mar 22, 2012
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIVE-TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, AND PATT...
- Publication number 20120021357
- Publication date Jan 26, 2012
- NEC Corporation
- Katsumi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110281401
- Publication date Nov 17, 2011
- RENESAS ELECTRONICS CORPORATION
- Kentaro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20110215478
- Publication date Sep 8, 2011
- NEC Corporation
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110175213
- Publication date Jul 21, 2011
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FO...
- Publication number 20110155433
- Publication date Jun 30, 2011
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shintaro Yamamichi

Person

Patents Grantslast 30 patents

Electronic device

Semiconductor device

Semiconductor device

Semiconductor device including a plurality of magnetic shields

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device manufacturing method

Functional element built-in substrate and wiring substrate

Method for manufacturing semiconductor device

Method for fabricating a metal-insulator-metal (MIM) capacitor havi...

Semiconductor element-embedded substrate, and method of manufacturi...

Wiring board with built-in semiconductor element

Semiconductor device and method of manufacturing semiconductor device

Semiconductor element-embedded wiring substrate

Semiconductor device manufacture in which minimum wiring pitch of c...

Wiring board capable of containing functional element and method fo...

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Wiring board, semiconductor device, and method for manufacturing wi...

Semiconductor device and method for manufacturing the same

Method of manufacturing a wiring board

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device having a thin film capacitor of a MIM (metal-i...

Wiring substrate for mounting semiconductors, method of manufacturi...

Metal-insulator-metal (MIM) capacitor having capacitor dielectric m...

Semiconductor device and method of manufacturing same

Wiring board, semiconductor device, and method of manufacturing the...

Semiconductor device including an LSI chip and a method for manufac...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

METHOD FOR FABRICATING A METAL-INSULATOR-METAL (MIM) CAPACITOR HAVI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE

MULTIMEDIA PROVIDING SERVICE

SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT

FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...

WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

SEMICONDUCTOR DEVICE HAVING A THIN FILM CAPACITOR AND METHOD FOR FA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device And Method Of Manufacturing Semiconductor Device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POSITIVE-TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, AND PATT...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FO...

METHOD OF MANUFACTURING A WIRING BOARD