Shiro Uchiyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor assemblies with system and methods for aligning dies...
- Patent number 11,955,461
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice assemblies, packages and systems, and methods of...
- Patent number 11,380,665
- Issue date Jul 5, 2022
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming conductive plugs for memory device
- Patent number 10,896,875
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice assemblies, packages and systems, and methods of...
- Patent number 10,600,770
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming conductive plugs for memory device
- Patent number 10,438,888
- Issue date Oct 8, 2019
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming conductive plugs for memory device
- Patent number 9,997,452
- Issue date Jun 12, 2018
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,937,390
- Issue date Jan 20, 2015
- PS4 Luxco S.A.R.L.
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor device and manufacturing method thereof
- Patent number 8,722,502
- Issue date May 13, 2014
- Shiro Uchiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,704,352
- Issue date Apr 22, 2014
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor and manufacturing method thereof
- Patent number 8,536,711
- Issue date Sep 17, 2013
- Elpida Memory, Inc.
- Shiro Uchiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
- Patent number 8,334,465
- Issue date Dec 18, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,004,090
- Issue date Aug 23, 2011
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor device and manufacturing method thereof
- Patent number 7,943,470
- Issue date May 17, 2011
- Elpida Memory, Inc.
- Shiro Uchiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,897,459
- Issue date Mar 1, 2011
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,842,610
- Issue date Nov 30, 2010
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through electrode with a low resistan...
- Patent number 7,732,926
- Issue date Jun 8, 2010
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,323,785
- Issue date Jan 29, 2008
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS INCLUDING TSV STRUCTURE
- Publication number 20240421040
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- SEIJI NARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES...
- Publication number 20240234378
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES...
- Publication number 20230062701
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT FOR STACKED WAFERS AND SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230065325
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING CONDUCTIVE PLUGS FOR MEMORY DEVICE
- Publication number 20200035597
- Publication date Jan 30, 2020
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF...
- Publication number 20190385996
- Publication date Dec 19, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF...
- Publication number 20190348406
- Publication date Nov 14, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING CONDUCTIVE PLUGS FOR MEMORY DEVICE
- Publication number 20180301408
- Publication date Oct 18, 2018
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20140183730
- Publication date Jul 3, 2014
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-stacked semiconductor and manufacturing method thereof
- Publication number 20110193242
- Publication date Aug 11, 2011
- Elpida Memory, Inc.
- Shiro UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-stacked semiconductor device and manufacturing method thereof
- Publication number 20110195572
- Publication date Aug 11, 2011
- Elpida Memory, Inc.
- Shiro UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20100171213
- Publication date Jul 8, 2010
- Elpida Memory, Inc.
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20090134498
- Publication date May 28, 2009
- Elpida Memory, Inc.
- Hiroaki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090108464
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer of circuit board and joining structure of wafer or circuit board
- Publication number 20090109641
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip-stacked semiconductor device and manufacturing method thereof
- Publication number 20080237781
- Publication date Oct 2, 2008
- Elpida Memory, Inc.
- Shiro UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE
- Publication number 20080237806
- Publication date Oct 2, 2008
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080138982
- Publication date Jun 12, 2008
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080079112
- Publication date Apr 3, 2008
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070284634
- Publication date Dec 13, 2007
- ELPIDA MEMORY, INC.
- Shigeyuki Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070134819
- Publication date Jun 14, 2007
- Elpida Memory, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060220182
- Publication date Oct 5, 2006
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS

Shiro Uchiyama

Person

Patents Grantslast 30 patents

Semiconductor assemblies with system and methods for aligning dies...

Semiconductor dice assemblies, packages and systems, and methods of...

Forming conductive plugs for memory device

Semiconductor dice assemblies, packages and systems, and methods of...

Forming conductive plugs for memory device

Forming conductive plugs for memory device

Semiconductor device having a liquid cooling module

Chip-stacked semiconductor device and manufacturing method thereof

Semiconductor device having a liquid cooling module

Chip-stacked semiconductor and manufacturing method thereof

Wafer of circuit board and joining structure of wafer or circuit board

Semiconductor device and method for manufacturing the same

Chip-stacked semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device having a through electrode with a low resistan...

Semiconductor device

Patents Applicationslast 30 patents

APPARATUS INCLUDING TSV STRUCTURE

SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES...

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES...

WAFER ALIGNMENT FOR STACKED WAFERS AND SEMICONDUCTOR DEVICE ASSEMBLIES

FORMING CONDUCTIVE PLUGS FOR MEMORY DEVICE

SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF...

SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF...

FORMING CONDUCTIVE PLUGS FOR MEMORY DEVICE

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

Chip-stacked semiconductor and manufacturing method thereof

Chip-stacked semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Wafer of circuit board and joining structure of wafer or circuit board

Chip-stacked semiconductor device and manufacturing method thereof

THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device