Shoichi Osada

Person

Usui-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-curable resin composition and uses thereof
- Patent number 11,639,410
- Issue date May 2, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Horigome
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicone-modified epoxy resin composition and semiconductor device
- Patent number 11,028,269
- Issue date Jun 8, 2021
- Shin-Etsu Chemical Co., Ltd.
- Norifumi Kawamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor-encapsulating epoxy resin composition and semiconduct...
- Patent number 10,851,261
- Issue date Dec 1, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Oishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicone-modified epoxy resin composition and semiconductor device
- Patent number 10,676,635
- Issue date Jun 9, 2020
- Shin-Etsu Chemical Co., Ltd.
- Norifumi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation resin composition and semiconductor dev...
- Patent number 9,633,921
- Issue date Apr 25, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, metal-clad laminate, printed wiring board, and semiconduct...
- Patent number 8,796,375
- Issue date Aug 5, 2014
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 8,048,969
- Issue date Nov 1, 2011
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone resin composition for optical semiconductor devices
- Patent number 8,022,137
- Issue date Sep 20, 2011
- Shin-Etsu Chemical Co., Ltd.
- Yusuke Taguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 7,999,016
- Issue date Aug 16, 2011
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device encapsulated with resin composition
- Patent number 7,969,027
- Issue date Jun 28, 2011
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor-encapsulating epoxy resin composition, preparation me...
- Patent number 7,910,638
- Issue date Mar 22, 2011
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor devices and...
- Patent number 7,898,094
- Issue date Mar 1, 2011
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flame retardant and an epoxy resin composition comprising the same...
- Patent number 7,511,383
- Issue date Mar 31, 2009
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating flame retardant epoxy resin composition...
- Patent number 7,122,587
- Issue date Oct 17, 2006
- Shin-Etsu Chemical Co., Ltd.
- Tarou Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 7,095,125
- Issue date Aug 22, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,894,091
- Issue date May 17, 2005
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating flame retardant epoxy resin composition...
- Patent number 6,783,859
- Issue date Aug 31, 2004
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,630,745
- Issue date Oct 7, 2003
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Patent number 6,518,332
- Issue date Feb 11, 2003
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,297,306
- Issue date Oct 2, 2001
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,291,556
- Issue date Sep 18, 2001
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,274,251
- Issue date Aug 14, 2001
- Hokko Chemical Industry Co., Ltd.
- Kenji Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Patent number 6,221,509
- Issue date Apr 24, 2001
- Tatsumori Ltd.
- Tatsurou Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,168,872
- Issue date Jan 2, 2001
- Hokko Chemical Industry Co., Ltd.
- Kenji Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,162,878
- Issue date Dec 19, 2000
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,160,078
- Issue date Dec 12, 2000
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...
- Publication number 20230399467
- Publication date Dec 14, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20230312909
- Publication date Oct 5, 2023
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF
- Publication number 20210189043
- Publication date Jun 24, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20210024749
- Publication date Jan 28, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20210002474
- Publication date Jan 7, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20200392340
- Publication date Dec 17, 2020
- Shin-Etsu Chemical Co., Ltd.
- Norifumi KAWAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCT...
- Publication number 20190309184
- Publication date Oct 10, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Oishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20190144704
- Publication date May 16, 2019
- Shin-Etsu Chemical Co., Ltd.
- Norifumi KAWAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Encapsulating Resin Composition and Semiconductor Device
- Publication number 20190127580
- Publication date May 2, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20180334567
- Publication date Nov 22, 2018
- Shin-Etsu Chemical Co., Ltd.
- Norifumi KAWAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEV...
- Publication number 20160336246
- Publication date Nov 17, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A S...
- Publication number 20160251511
- Publication date Sep 1, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCT...
- Publication number 20130088842
- Publication date Apr 11, 2013
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- B32 - LAYERED PRODUCTS
Information Patent Application
SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES
- Publication number 20100081748
- Publication date Apr 1, 2010
- Yusuke TAGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...
- Publication number 20090192258
- Publication date Jul 30, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20080083995
- Publication date Apr 10, 2008
- SHIN-ETSU CHEMICAL CO., LTD.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor device encapsulated with resin composition
- Publication number 20070281164
- Publication date Dec 6, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition for encapsulating semiconductor devices and...
- Publication number 20070179259
- Publication date Aug 2, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20060241250
- Publication date Oct 26, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20060241215
- Publication date Oct 26, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flame retardant and an epoxy resin composition comprising the same...
- Publication number 20060223913
- Publication date Oct 5, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20060216520
- Publication date Sep 28, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin Composition and semiconduct...
- Publication number 20060025501
- Publication date Feb 2, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating flame retardant epoxy resin composition...
- Publication number 20040072968
- Publication date Apr 15, 2004
- Tarou Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20040034161
- Publication date Feb 19, 2004
- SHIN-ETSU CHEMICAL CO. LTD
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating flame retardant epoxy resin composition...
- Publication number 20030152777
- Publication date Aug 14, 2003
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Publication number 20020102429
- Publication date Aug 1, 2002
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20020016398
- Publication date Feb 7, 2002
- Shoichi Osada
- H01 - BASIC ELECTRIC ELEMENTS

Shoichi Osada

Person

Patents Grantslast 30 patents

Heat-curable resin composition and uses thereof

Silicone-modified epoxy resin composition and semiconductor device

Semiconductor-encapsulating epoxy resin composition and semiconduct...

Silicone-modified epoxy resin composition and semiconductor device

Semiconductor encapsulation resin composition and semiconductor dev...

Prepreg, metal-clad laminate, printed wiring board, and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Silicone resin composition for optical semiconductor devices

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor device encapsulated with resin composition

Semiconductor-encapsulating epoxy resin composition, preparation me...

Epoxy resin composition for encapsulating semiconductor devices and...

Flame retardant and an epoxy resin composition comprising the same...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...

THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCT...

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Semiconductor Encapsulating Resin Composition and Semiconductor Device

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEV...

RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A S...

PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCT...

SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES

SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

Semiconductor device encapsulated with resin composition

Epoxy resin composition for encapsulating semiconductor devices and...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Flame retardant and an epoxy resin composition comprising the same...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin Composition and semiconduct...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Semiconductor encapsulating epoxy resin composition and semiconduct...