Shoichiro OGATA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate holder and plating apparatus with substrate holder
- Patent number 11,248,308
- Issue date Feb 15, 2022
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak checking method, leak checking apparatus, electroplating metho...
- Patent number 10,982,347
- Issue date Apr 20, 2021
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak checking method, leak checking apparatus, electroplating metho...
- Patent number 10,458,036
- Issue date Oct 29, 2019
- Ebara Corporation
- Shoichiro Ogata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20210198800
- Publication date Jul 1, 2021
- EBARA CORPORATION
- Shoichiro OGATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS WITH SUBSTRATE HOLDER
- Publication number 20200263316
- Publication date Aug 20, 2020
- EBARA CORPORATION
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20200010972
- Publication date Jan 9, 2020
- EBARA CORPORATION
- Shoichiro OGATA
- G01 - MEASURING TESTING
Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20180135198
- Publication date May 17, 2018
- EBARA CORPORATION
- Shoichiro OGATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR