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Shoji Nakakita
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Tokyo, JP
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last 30 patents
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Patent Grant
Method of manufacturing a multichip package with increased adhesive...
Patent number
4,874,721
Issue date
Oct 17, 1989
NEC Corporation
Mitsuru Kimura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-layered substrate having a fine wiring structure for LSI or V...
Patent number
4,569,876
Issue date
Feb 11, 1986
NEC Corporation
Shoji Nakakita
H01 - BASIC ELECTRIC ELEMENTS