Shosaku Ishihara

Person

Chigasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module with MOS chip
- Patent number 7,719,100
- Issue date May 18, 2010
- Hitachi, Ltd.
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 7,498,671
- Issue date Mar 3, 2009
- Hitachi, Ltd.
- Shinichi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,423,349
- Issue date Sep 9, 2008
- Hitachi, Ltd.
- Shosaku Ishihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,193,319
- Issue date Mar 20, 2007
- Hitachi, Ltd.
- Koji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic part, its manufacturing method, two-dimension...
- Patent number 6,798,059
- Issue date Sep 28, 2004
- Hitachi, Ltd.
- Shosaku Ishihara
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method of manufacturing via interconnection of glass-ceramic wiring...
- Patent number 6,658,733
- Issue date Dec 9, 2003
- Hitachi, Ltd.
- Norihiro Ami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass-ceramic wiring board
- Patent number 6,384,347
- Issue date May 7, 2002
- Hitachi, Ltd.
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramics substrate with electronic circuit and its manufacturing me...
- Patent number 6,248,960
- Issue date Jun 19, 2001
- Hitachi, Ltd.
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic multilayer wiring board
- Patent number 4,604,496
- Issue date Aug 5, 1986
- Hitachi, Ltd.
- Shosaku Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Metal Bonding Member and Fabrication Method of the Same
- Publication number 20110244262
- Publication date Oct 6, 2011
- Hitachi, Ltd
- Keishi SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LITHIUM SECONDARY BATTERY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110206985
- Publication date Aug 25, 2011
- Hitachi, Ltd.
- Shosaku ISHIHARA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mounting Substrate Suitable for Use to Install Surface Mount Compon...
- Publication number 20080261001
- Publication date Oct 23, 2008
- Tetsuya Nakatsuka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20080061431
- Publication date Mar 13, 2008
- Shinichi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20070069344
- Publication date Mar 29, 2007
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060246304
- Publication date Nov 2, 2006
- Shosaku Ishihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20060214291
- Publication date Sep 28, 2006
- Koji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing via interconnnection of glass-ceramic wirin...
- Publication number 20010033891
- Publication date Oct 25, 2001
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic circuit board with built-in thin film capacitor and manu...
- Publication number 20010026444
- Publication date Oct 4, 2001
- Naoki Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Glass-ceramic wiring board
- Publication number 20010025722
- Publication date Oct 4, 2001
- Norihiro Ami
- H01 - BASIC ELECTRIC ELEMENTS

Shosaku Ishihara

Person

Patents Grantslast 30 patents

Power semiconductor module with MOS chip

Power semiconductor module

Semiconductor device

Semiconductor device

Multilayer electronic part, its manufacturing method, two-dimension...

Method of manufacturing via interconnection of glass-ceramic wiring...

Glass-ceramic wiring board

Ceramics substrate with electronic circuit and its manufacturing me...

Ceramic multilayer wiring board

Patents Applicationslast 30 patents

Metal Bonding Member and Fabrication Method of the Same

LITHIUM SECONDARY BATTERY AND METHOD FOR MANUFACTURING THE SAME

Mounting Substrate Suitable for Use to Install Surface Mount Compon...

POWER SEMICONDUCTOR MODULE

Semiconductor module

Semiconductor device

Semiconductor device

Method of manufacturing via interconnnection of glass-ceramic wirin...

Electronic circuit board with built-in thin film capacitor and manu...

Glass-ceramic wiring board