Shou-tsung Wang

Person

Sinying City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 11,670,575
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,239,193
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including metallic bolstering pattern and manufacturing met...
- Patent number 11,177,218
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,171,090
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 11,088,059
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for wafer level packaging and manufacturing m...
- Patent number 10,879,201
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,756,038
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 9,812,416
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 9,646,928
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid design for reliability enhancement in flip chip package
- Patent number 8,976,529
- Issue date Mar 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for enhancing DC offset correction speed of a...
- Patent number 8,195,096
- Issue date Jun 5, 2012
- Mediatek Inc.
- Chinq-shiun Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit for settling DC offset in direct conversion receiver
- Patent number 7,933,575
- Issue date Apr 26, 2011
- MediaTek, Inc.
- Yuan-hung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Controllable resistive circuit for providing a continuous variable...
- Patent number 7,760,003
- Issue date Jul 20, 2010
- Mediatek Inc.
- Chia-hsin Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Input/output device capable of blocking external interference signals
- Patent number 7,679,869
- Issue date Mar 16, 2010
- Mediatek Inc.
- Bing-Jye Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of feeding internal calibration signal through...
- Patent number 7,567,787
- Issue date Jul 28, 2009
- Mediatek Inc.
- Bing-Jye Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Phase-locked loop with VCO tuning sensitivity compensation
- Patent number 7,508,277
- Issue date Mar 24, 2009
- Mediatek Inc.
- Chang-Fu Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Phase lock loop applying in wireless communication system and metho...
- Patent number 7,363,013
- Issue date Apr 22, 2008
- Mediatek Inc.
- Chang-Fu Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
DC offset calibration apparatus
- Patent number 7,271,649
- Issue date Sep 18, 2007
- MediaTek Inc.
- Chinq-Shiun Chiu
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240222307
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HA...
- Publication number 20230260882
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230009901
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220157760
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HA...
- Publication number 20210366815
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING METALLIC BOLSTERING PATTERN AND MANUFACTURING MET...
- Publication number 20210296243
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210225792
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, RDL STRUCTURE AND METHOD OF FORMIGN THE SAME
- Publication number 20200395280
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200381382
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273828
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20200075488
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
- Publication number 20170243842
- Publication date Aug 24, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
- Publication number 20150262933
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Design for Reliability Enhancement in Flip Chip Package
- Publication number 20120182694
- Publication date Jul 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT FOR SETTLING DC OFFSET IN DIRECT CONVERSION RECEIVER
- Publication number 20090212839
- Publication date Aug 27, 2009
- MediaTek, Inc.
- Yuan-hung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOS CAPACITOR WITH LARGE CONSTANT VALUE
- Publication number 20080284495
- Publication date Nov 20, 2008
- MEDIATEK INC.
- Kuei-ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLABLE RESISTIVE CIRCUIT FOR PROVIDING A CONTINUOUS VARIABLE...
- Publication number 20080106317
- Publication date May 8, 2008
- MEDIA TEK INC.
- Chia-hsin Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPARATUS AND METHOD OF FEEDING INTERNAL CALIBRATION SIGNAL THROUGH...
- Publication number 20080077346
- Publication date Mar 27, 2008
- Bing-Jye Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INPUT/OUTPUT DEVICE CAPABLE OF BLOCKING EXTERNAL INTERFERENCE SIGNALS
- Publication number 20080062594
- Publication date Mar 13, 2008
- MEDIATEK INC.
- Bing-Jye Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPARATUS AND METHOD FOR ENHANCING DC OFFSET CORRECTION SPEED OF A...
- Publication number 20080026719
- Publication date Jan 31, 2008
- MEDIATEK Inc.
- Chinq-shiun Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Calibration method for suppressing second order distortion
- Publication number 20060234664
- Publication date Oct 19, 2006
- Mediatek Incorporation
- Ching-Shiun Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Phase-locked loop with VCO tuning sensitivity compensation
- Publication number 20060208804
- Publication date Sep 21, 2006
- MediaTek Inc.
- Chang-Fu Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DC OFFSET CALIBRATION APPARATUS
- Publication number 20060077003
- Publication date Apr 13, 2006
- Chinq-Shiun Chiu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ANALOG DEMODULATOR IN A LOW-IF RECEIVER
- Publication number 20040147238
- Publication date Jul 29, 2004
- Shou-Tsung Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Phase lock loop applying in wireless communication system and metho...
- Publication number 20040087289
- Publication date May 6, 2004
- MediaTek Inc.
- Chang-Fu Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY

Shou-tsung Wang

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Integrated circuit package and method

Package structure, RDL structure comprising redistribution layer ha...

Integrated circuit package and method

Package including metallic bolstering pattern and manufacturing met...

Semiconductor device and method of manufacture

Package structure, RDL structure comprising redistribution layer ha...

Semiconductor package for wafer level packaging and manufacturing m...

Semiconductor package and manufacturing method thereof

Semiconductor arrangement and formation thereof

Semiconductor arrangement and formation thereof

Lid design for reliability enhancement in flip chip package

Apparatus and method for enhancing DC offset correction speed of a...

Circuit for settling DC offset in direct conversion receiver

Controllable resistive circuit for providing a continuous variable...

Input/output device capable of blocking external interference signals

Apparatus and method of feeding internal calibration signal through...

Phase-locked loop with VCO tuning sensitivity compensation

Phase lock loop applying in wireless communication system and metho...

DC offset calibration apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES

PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HA...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method

PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HA...

PACKAGE INCLUDING METALLIC BOLSTERING PATTERN AND MANUFACTURING MET...

Integrated Circuit Package and Method

PACKAGE STRUCTURE, RDL STRUCTURE AND METHOD OF FORMIGN THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF

SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF

Lid Design for Reliability Enhancement in Flip Chip Package

CIRCUIT FOR SETTLING DC OFFSET IN DIRECT CONVERSION RECEIVER

MOS CAPACITOR WITH LARGE CONSTANT VALUE

CONTROLLABLE RESISTIVE CIRCUIT FOR PROVIDING A CONTINUOUS VARIABLE...

APPARATUS AND METHOD OF FEEDING INTERNAL CALIBRATION SIGNAL THROUGH...

INPUT/OUTPUT DEVICE CAPABLE OF BLOCKING EXTERNAL INTERFERENCE SIGNALS

APPARATUS AND METHOD FOR ENHANCING DC OFFSET CORRECTION SPEED OF A...

Calibration method for suppressing second order distortion

Phase-locked loop with VCO tuning sensitivity compensation

DC OFFSET CALIBRATION APPARATUS

ANALOG DEMODULATOR IN A LOW-IF RECEIVER

Phase lock loop applying in wireless communication system and metho...