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Component mounting apparatus
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Patent number 8,001,678
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Issue date Aug 23, 2011
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Panasonic Corporation
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Akira Kabeshita
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Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Component mounting apparatus
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Patent number 7,827,677
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Issue date Nov 9, 2010
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Panasonic Corporation
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Yasuharu Ueno
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Component mounting method
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Patent number 7,437,818
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Issue date Oct 21, 2008
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Matsushita Electric Industrial Co., Ltd.
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Akira Kabeshita
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H01 - BASIC ELECTRIC ELEMENTS
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Component mounting method
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Patent number 7,281,322
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Issue date Oct 16, 2007
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Matsushita Electric Industrial Co., Ltd.
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Shunji Onobori
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Bump-joining method
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Patent number 6,572,005
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Issue date Jun 3, 2003
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Matsushita Electric Industrial Co., Ltd.
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Shozo Minamitani
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H01 - BASIC ELECTRIC ELEMENTS
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Bump joining method
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Patent number 6,321,973
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Issue date Nov 27, 2001
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Matsushita Electric Industrial Co., Ltd.
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Shozo Minamitani
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H01 - BASIC ELECTRIC ELEMENTS
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Component mounting method and apparatus
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Patent number 6,193,136
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Issue date Feb 27, 2001
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Matsushita Electric Industrial Co., Ltd.
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Kazushi Higashi
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR