Shripad Gokhale

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inline measurement of molding material thickness using terahertz re...
- Patent number 9,508,610
- Issue date Nov 29, 2016
- Intel Corporation
- Shuhong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing underfill keep out zone on substrate used in electronic de...
- Patent number 8,362,627
- Issue date Jan 29, 2013
- Intel Corporation
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing underfill keep out zone on substrate used in electronic de...
- Patent number 7,875,503
- Issue date Jan 25, 2011
- Intel Corporation
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling substrate surface properties via colloidal coatings
- Patent number 7,687,890
- Issue date Mar 30, 2010
- Intel Corporation
- Gopalakrishnan Subramanian
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
PERMANENT LAYER FOR BUMP CHIP ATTACH
- Publication number 20240178097
- Publication date May 30, 2024
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
- Publication number 20240128253
- Publication date Apr 18, 2024
- Intel Corporation
- Denis MYASISHCHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
- Publication number 20210066273
- Publication date Mar 4, 2021
- Intel Corporation
- Denis MYASISHCHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE MEASUREMENT OF MOLDING MATERIAL THICKNESS USING TERAHERTZ RE...
- Publication number 20160093540
- Publication date Mar 31, 2016
- Intel Corporation
- Shuhong LIU
- G01 - MEASURING TESTING
Information Patent Application
REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...
- Publication number 20110084388
- Publication date Apr 14, 2011
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling substrate surface properties via colloidal coatings
- Publication number 20080237810
- Publication date Oct 2, 2008
- Gopalakrishnan Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...
- Publication number 20080157352
- Publication date Jul 3, 2008
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling flow of underfill using polymer coating and resulting d...
- Publication number 20080142996
- Publication date Jun 19, 2008
- Gopalakrishnan Subramanian
- H01 - BASIC ELECTRIC ELEMENTS

Shripad Gokhale

Person

Patents Grantslast 30 patents

Inline measurement of molding material thickness using terahertz re...

Reducing underfill keep out zone on substrate used in electronic de...

Reducing underfill keep out zone on substrate used in electronic de...

Controlling substrate surface properties via colloidal coatings

Patents Applicationslast 30 patents

PERMANENT LAYER FOR BUMP CHIP ATTACH

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...

INLINE MEASUREMENT OF MOLDING MATERIAL THICKNESS USING TERAHERTZ RE...

REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...

Controlling substrate surface properties via colloidal coatings

REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...

Controlling flow of underfill using polymer coating and resulting d...