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Shriram Ramanathan
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Hillsboro, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic package having direct contact heat spreader and met...
Patent number
9,508,675
Issue date
Nov 29, 2016
Intel Corporation
Daoqiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package having direct contact heat spreader and met...
Patent number
8,541,876
Issue date
Sep 24, 2013
Intel Corporation
Daoqiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, method, and system for separation and detection of biomolec...
Patent number
8,512,559
Issue date
Aug 20, 2013
Intel Corporation
Shriram Ramanathan
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Three-dimensional stacked substrate arrangements
Patent number
8,421,225
Issue date
Apr 16, 2013
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional stacked substrate arrangements
Patent number
8,203,208
Issue date
Jun 19, 2012
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-metal bonding of compliant interconnect
Patent number
8,030,782
Issue date
Oct 4, 2011
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional stacked substrate arrangements
Patent number
7,973,407
Issue date
Jul 5, 2011
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Portable NMR device and method for making and using the same
Patent number
7,800,371
Issue date
Sep 21, 2010
Intel Corporation
Chang-Min Park
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Metal-metal bonding of compliant interconnect
Patent number
7,750,487
Issue date
Jul 6, 2010
Intel Corporation
Sriram Muthukumar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked wafer or die packaging with enhanced thermal and device per...
Patent number
7,723,759
Issue date
May 25, 2010
Intel Corporation
Rajashree Baskaran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming a hybrid device
Patent number
7,692,310
Issue date
Apr 6, 2010
Intel Corporation
Chang-Min Park
G11 - INFORMATION STORAGE
Information
Patent Grant
Methods of forming channels on an integrated circuit die and die co...
Patent number
7,663,230
Issue date
Feb 16, 2010
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
Patent number
7,589,417
Issue date
Sep 15, 2009
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
Patent number
7,537,954
Issue date
May 26, 2009
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D integrated circuits using thick metal for backside connections a...
Patent number
7,410,884
Issue date
Aug 12, 2008
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming self-passivating interconnects and resulting devices
Patent number
7,402,509
Issue date
Jul 22, 2008
Intel Corporation
Mauro J. Kobrinsky
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of forming channels on an integrated circuit die and die co...
Patent number
7,358,201
Issue date
Apr 15, 2008
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Portable NMR device and method for making and using the same
Patent number
7,345,479
Issue date
Mar 18, 2008
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Grant
Method of forming a stacked device filler
Patent number
7,320,928
Issue date
Jan 22, 2008
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method using magnetic pattern on disk
Patent number
7,319,323
Issue date
Jan 15, 2008
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Grant
Wafer bonding with highly compliant plate having filler material en...
Patent number
7,307,005
Issue date
Dec 11, 2007
Intel Corporation
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated on-chip NMR and ESR device and method for making and usi...
Patent number
7,274,191
Issue date
Sep 25, 2007
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Grant
Method for wafer stacking using copper structures of substantially...
Patent number
7,268,015
Issue date
Sep 11, 2007
Intel Corporation
Vijayakumar S. RamachandraRao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deposition of diffusion barrier
Patent number
7,214,605
Issue date
May 8, 2007
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrating thermoelectric elements into wafer for heat extraction
Patent number
7,211,890
Issue date
May 1, 2007
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of bonding semiconductor devices
Patent number
7,186,637
Issue date
Mar 6, 2007
Intel Corporation
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for low temperature copper to copper bonding
Patent number
7,183,648
Issue date
Feb 27, 2007
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked device underfill and a method of fabrication
Patent number
7,180,180
Issue date
Feb 20, 2007
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming vias on a wafer stack using laser ablation
Patent number
7,118,989
Issue date
Oct 10, 2006
Intel Corporation
Shriram Ramanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method to fill the gap between coupled wafers
Patent number
7,087,538
Issue date
Aug 8, 2006
Intel Corporation
David Staines
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DEVICE, METHOD, AND SYSTEM FOR SEPARATION AND DETECTION OF BIOMOLEC...
Publication number
20140008281
Publication date
Jan 9, 2014
Intel Corporation
Shriram Ramanathan
B82 - NANO-TECHNOLOGY
Information
Patent Application
MICROELECTRONIC PACKAGE HAVING DIRECT CONTACT HEAT SPREADER AND MET...
Publication number
20130344659
Publication date
Dec 26, 2013
Daoqiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS
Publication number
20120280387
Publication date
Nov 8, 2012
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS
Publication number
20110260319
Publication date
Oct 27, 2011
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-dimensional integrated circuit for analyte detection
Publication number
20100248209
Publication date
Sep 30, 2010
Suman Datta
G01 - MEASURING TESTING
Information
Patent Application
METAL-METAL BONDING OF COMPLIANT INTERCONNECT
Publication number
20100237505
Publication date
Sep 23, 2010
Sriram Muthukumar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-dimensional stacked substrate arrangements
Publication number
20090174070
Publication date
Jul 9, 2009
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of forming channels on an integrated circuit die and die co...
Publication number
20080185714
Publication date
Aug 7, 2008
Intel Corporation
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PORTABLE NMR DEVICE AND METHOD FOR MAKING AND USING THE SAME
Publication number
20070296413
Publication date
Dec 27, 2007
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Application
HIGHLY COMPLIANT PLATE FOR WAFER BONDING
Publication number
20070284409
Publication date
Dec 13, 2007
Mauro Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGHLY COMPLIANT PLATE FOR WAFER BONDING
Publication number
20070287263
Publication date
Dec 13, 2007
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making a substrate having thermally conductive structures...
Publication number
20070235847
Publication date
Oct 11, 2007
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device and method using magnetic pattern on disk
Publication number
20070229078
Publication date
Oct 4, 2007
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Application
Forming a hybrid device
Publication number
20070221961
Publication date
Sep 27, 2007
Chang-Min Park
G11 - INFORMATION STORAGE
Information
Patent Application
Optical magnetometer array and method for making and using the same
Publication number
20070167723
Publication date
Jul 19, 2007
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Application
Portable NMR device and method for making and using the same
Publication number
20070152670
Publication date
Jul 5, 2007
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Application
INTEGRATED ON-CHIP NMR AND ESR DEVICE AND METHOD FOR MAKING AND USI...
Publication number
20070152669
Publication date
Jul 5, 2007
Intel Corporation
Chang-Min Park
G01 - MEASURING TESTING
Information
Patent Application
3D integrated circuits using thick metal for backside connections a...
Publication number
20070117348
Publication date
May 24, 2007
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device, method, and system for separation and detection of biomolec...
Publication number
20070114180
Publication date
May 24, 2007
Intel Corporation
Shriram Ramanathan
G01 - MEASURING TESTING
Information
Patent Application
Stacked wafer or die packaging with enhanced thermal and device per...
Publication number
20070093066
Publication date
Apr 26, 2007
Rajashree Baskaran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic package having direct contact heat spreader and met...
Publication number
20070075420
Publication date
Apr 5, 2007
Intel Corporation
Daoqiang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper bump barrier cap to reduce electrical resistance
Publication number
20070045833
Publication date
Mar 1, 2007
Ting Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for bonding wafers
Publication number
20060292823
Publication date
Dec 28, 2006
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metrology system and method for stacked wafer alignment
Publication number
20060249859
Publication date
Nov 9, 2006
Travis M. Eiles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Gap-filling in electronic assemblies including a TEC structure
Publication number
20060243315
Publication date
Nov 2, 2006
Gregory M. Chrysler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming self-passivating interconnects and resulting devices
Publication number
20060220197
Publication date
Oct 5, 2006
Mauro J. Kobrinsky
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Limiting net curvature in a wafer
Publication number
20060202209
Publication date
Sep 14, 2006
Maxim B. Kelman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for wafer stacking using copper structures of substantially...
Publication number
20060138618
Publication date
Jun 29, 2006
Vijayakumar S. RamachandraRao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic assembly having thermoelectric elements to cool a d...
Publication number
20060097383
Publication date
May 11, 2006
Shriram Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming vias on a wafer stack using laser ablation
Publication number
20060040471
Publication date
Feb 23, 2006
Shriram Ramanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR