Shu-Hui SU

Person

Tucheng City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with capacitor and method for forming the same
- Patent number 11,923,352
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 11,769,792
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 11,749,673
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for operating the same
- Patent number 11,710,962
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Device and method for operating the same
- Patent number 11,355,927
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
ESD protection device
- Patent number 11,355,491
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 11,063,157
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 10,777,547
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an air-gap region and a method of ma...
- Patent number 10,361,152
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an air-gap region and a method of ma...
- Patent number 8,999,839
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including barrier layers fo...
- Patent number 8,975,749
- Issue date Mar 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Big via structure
- Patent number 8,716,871
- Issue date May 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layers for copper interconnect
- Patent number 8,653,664
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an air-gap region and a method of ma...
- Patent number 8,456,009
- Issue date Jun 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of silicon controlled rectifier
- Patent number 7,638,857
- Issue date Dec 29, 2009
- United Microelectronics Corp.
- Hsin-Yen Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-clock controlled logic signal generating circuit
- Patent number 7,272,069
- Issue date Sep 18, 2007
- RDC Semiconductor Co., Ltd.
- Shu-Min Su
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240178211
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIN-LI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240113159
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20240047513
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240030359
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD Protection Device
- Publication number 20240021603
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE
- Publication number 20240021513
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR FILM SCHEME TO REDUCE SUBSTRATE WARPAGE
- Publication number 20240014254
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20230378251
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE
- Publication number 20230317521
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR OPERATING THE SAME
- Publication number 20230299576
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20230246014
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIN-LI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR OPERATING THE SAME
- Publication number 20220294212
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ESD Protection Device
- Publication number 20220262788
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR OPERATING THE SAME
- Publication number 20220029414
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lin PENG
- G01 - MEASURING TESTING
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20210343881
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20210202761
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD Protection Device
- Publication number 20200373294
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD Protection Device
- Publication number 20170346277
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Yu Su
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...
- Publication number 20150200160
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE INCLUDING BARRIER LAYERS FO...
- Publication number 20140127898
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...
- Publication number 20130252144
- Publication date Sep 26, 2013
- TAIWAN SEMICONDUCTOR MANUFACTURING COMAPNY, LTD.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL PROCESS FOR FORMING A BIG VIA
- Publication number 20130207276
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Uway Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...
- Publication number 20110198757
- Publication date Aug 18, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR COPPER INTERCONNECT
- Publication number 20110006429
- Publication date Jan 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF SILICON CONTROLLED RECTIFIER
- Publication number 20090278168
- Publication date Nov 12, 2009
- United Microelectronics Corp.
- Hsin-Yen Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device with capacitor and method for forming the same

Trench capacitor profile to decrease substrate warpage

ESD protection device

Device and method for operating the same

Device and method for operating the same

ESD protection device

Trench capacitor profile to decrease substrate warpage

ESD protection device

Semiconductor structure having an air-gap region and a method of ma...

Semiconductor structure having an air-gap region and a method of ma...

Method of making a semiconductor device including barrier layers fo...

Big via structure

Barrier layers for copper interconnect

Semiconductor structure having an air-gap region and a method of ma...

Structure of silicon controlled rectifier

Multiple-clock controlled logic signal generating circuit

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME

ESD Protection Device

ETCH STOP STRUCTURE FOR IC TO INCREASE STABILITY AND ENDURANCE

TRENCH CAPACITOR FILM SCHEME TO REDUCE SUBSTRATE WARPAGE

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE

DEVICE AND METHOD FOR OPERATING THE SAME

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME

DEVICE AND METHOD FOR OPERATING THE SAME

ESD Protection Device

DEVICE AND METHOD FOR OPERATING THE SAME

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

ESD Protection Device

ESD Protection Device

SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...

METHOD OF MAKING A SEMICONDUCTOR DEVICE INCLUDING BARRIER LAYERS FO...

SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...

NOVEL PROCESS FOR FORMING A BIG VIA

SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...

BARRIER LAYERS FOR COPPER INTERCONNECT

STRUCTURE OF SILICON CONTROLLED RECTIFIER