Shu-Ya TSAI

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,916,091
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device
- Patent number 11,915,977
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 11,798,916
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated global shutter image sensor
- Patent number 11,769,781
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,596,800
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,551,597
- Issue date Jan 10, 2023
- E Ink Holdings Inc.
- Chia-Chi Chang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,315,972
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated global shutter image sensor
- Patent number 11,018,177
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for 3D image sensor
- Patent number 11,011,567
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device
- Patent number 10,978,345
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel structure
- Patent number 10,879,275
- Issue date Dec 29, 2020
- E Ink Holdings Inc.
- Ji-Yuan Li
- G02 - OPTICS
Information Patent Grant
Interconnect structure for stacked device and method
- Patent number 10,861,899
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 10,847,560
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,840,287
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch sensor and electronic paper display panel
- Patent number 10,824,290
- Issue date Nov 3, 2020
- E Ink Holdings Inc.
- Hsiao-Lung Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked image sensor having a barrier layer
- Patent number 10,818,720
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect apparatus and method for a stacked semiconductor device
- Patent number 10,763,292
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,682,523
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Display device having a plurality of subpixels having shared data l...
- Patent number 10,672,323
- Issue date Jun 2, 2020
- E Ink Holdings Inc.
- Chien-Hung Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Pixel array substrate and display device
- Patent number 10,593,246
- Issue date Mar 17, 2020
- E Ink Holdings Inc.
- Shu-Fen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device and method
- Patent number 10,535,706
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for 3D Image sensor
- Patent number 10,535,697
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,510,729
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 10,475,398
- Issue date Nov 12, 2019
- E Ink Holdings Inc.
- Yao-Te Tseng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 10,361,234
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices having conductive plu...
- Patent number 10,304,818
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor having a barrier layer
- Patent number 10,283,547
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 10,269,843
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, pixel array substrate and line array structure
- Patent number 10,256,257
- Issue date Apr 9, 2019
- E Ink Holdings Inc.
- Ian French
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REACTION APPARATUS
- Publication number 20240208880
- Publication date Jun 27, 2024
- Industrial Technology Research Institute
- Shih-Chi LEE
- C05 - FERTILISERS MANUFACTURE THEREOF
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING
- Publication number 20240038818
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Y.W. HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20230378139
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND DRIVING CIRCUIT STRUCTURE
- Publication number 20230352452
- Publication date Nov 2, 2023
- E Ink Holdings Inc.
- Shu-Fen TSAI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD OF PREPARING FERMENTED FOOD BY USING NOVEL RHIZOPUS MICROSPO...
- Publication number 20230210149
- Publication date Jul 6, 2023
- Industrial Technology Research Institute
- Chun-Shen CHENG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20230201613
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ULTRASONIC EXTRACTION EQUIPMENT
- Publication number 20230201742
- Publication date Jun 29, 2023
- Industrial Technology Research Institute
- Chih-Hsuan FAN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ELECTROPHORETIC DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220244611
- Publication date Aug 4, 2022
- E Ink Holdings Inc.
- Shu-Fen TSAI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20220208749
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210358371
- Publication date Nov 18, 2021
- E Ink Holdings Inc.
- Chia-Chi Chang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
BACKSIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSOR
- Publication number 20210272989
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Stacked Device
- Publication number 20210233813
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20210233945
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20210066357
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSOR
- Publication number 20200381465
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20200306552
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TOUCH SENSOR AND ELECTRONIC PAPER DISPLAY PANEL
- Publication number 20200142520
- Publication date May 7, 2020
- E Ink Holdings Inc.
- Hsiao-Lung Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Interconnect Structure for Stacked Device and Method
- Publication number 20200127027
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for 3D Image Sensor
- Publication number 20200075659
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20190363126
- Publication date Nov 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH SENSOR, ELECTRONIC PAPER DISPLAY PANEL AND ELECTRONIC PAPER D...
- Publication number 20190354212
- Publication date Nov 21, 2019
- E Ink Holdings Inc.
- Hsiao-Lung Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190279974
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL STRUCTURE
- Publication number 20190267403
- Publication date Aug 29, 2019
- E Ink Holdings Inc.
- Ji-Yuan LI
- G02 - OPTICS
Information Patent Application
STACKED IMAGE SENSOR HAVING A BARRIER LAYER
- Publication number 20190259799
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20190252423
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING NANOSTRUCTURES AND DEVICE HAVING THE NANOSTR...
- Publication number 20190189840
- Publication date Jun 20, 2019
- National Cheng Kung University
- Shu-Ju Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Apparatus and Method
- Publication number 20190148435
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20190139476
- Publication date May 9, 2019
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Interconnect Structure for Stacked Device and Method
- Publication number 20190131330
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190122603
- Publication date Apr 25, 2019
- E Ink Holdings Inc.
- Chien-Hung LIN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Shu-Ya TSAI

Person

Patents Grantslast 30 patents

Display device and driving circuit structure

BSI image sensor and method of forming same

Interconnect structure for stacked device

3DIC interconnect apparatus and method

Backside illuminated global shutter image sensor

Interconnect structure and method of forming same

Electronic device

BSI image sensor and method of forming same

Backside illuminated global shutter image sensor

Structure and method for 3D image sensor

Interconnect structure for stacked device

Pixel structure

Interconnect structure for stacked device and method

BSI image sensor and method of forming same

3DIC interconnect apparatus and method

Touch sensor and electronic paper display panel

Stacked image sensor having a barrier layer

Interconnect apparatus and method for a stacked semiconductor device

Interconnect structure and method of forming same

Display device having a plurality of subpixels having shared data l...

Pixel array substrate and display device

Interconnect structure for stacked device and method

Structure and method for 3D Image sensor

3DIC interconnect apparatus and method

Display device and manufacturing method thereof

3DIC interconnect apparatus and method

Method of manufacturing semiconductor devices having conductive plu...

Stacked image sensor having a barrier layer

BSI image sensor and method of forming same

Display panel, pixel array substrate and line array structure

Patents Applicationslast 30 patents

REACTION APPARATUS

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING

3DIC Interconnect Apparatus and Method

DISPLAY DEVICE AND DRIVING CIRCUIT STRUCTURE

METHOD OF PREPARING FERMENTED FOOD BY USING NOVEL RHIZOPUS MICROSPO...

Interconnect Structure and Method of Forming Same

ULTRASONIC EXTRACTION EQUIPMENT

ELECTROPHORETIC DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

ELECTRONIC DEVICE

BACKSIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSOR

Interconnect Structure for Stacked Device

BSI Image Sensor and Method of Forming Same

BSI Image Sensor and Method of Forming Same

BACKSIDE ILLUMINATED GLOBAL SHUTTER IMAGE SENSOR

Interconnect Structure and Method of Forming Same

TOUCH SENSOR AND ELECTRONIC PAPER DISPLAY PANEL

Interconnect Structure for Stacked Device and Method

Structure and Method for 3D Image Sensor

3DIC Interconnect Apparatus and Method

TOUCH SENSOR, ELECTRONIC PAPER DISPLAY PANEL AND ELECTRONIC PAPER D...

Semiconductor Devices and Methods of Manufacture Thereof

PIXEL STRUCTURE

STACKED IMAGE SENSOR HAVING A BARRIER LAYER

BSI Image Sensor and Method of Forming Same

METHOD OF TRANSFERRING NANOSTRUCTURES AND DEVICE HAVING THE NANOSTR...

Interconnect Apparatus and Method

PIXEL ARRAY SUBSTRATE AND DISPLAY DEVICE

Interconnect Structure for Stacked Device and Method

DISPLAY DEVICE